Satellite remote sensing technology[1] is widely used in all walks of life ,which plays an increasingly remarkable results in natural disasters(sudden and major).With more and more launch and application of high resol...Satellite remote sensing technology[1] is widely used in all walks of life ,which plays an increasingly remarkable results in natural disasters(sudden and major).With more and more launch and application of high resolution satellite, the texture information in remote sensing imagery becomes much more abundant. In the age of big data, for the infrared remote sensor has short life, which annoys many people. In the packaging process, due to a difference in thermal expansion coefficients [2] between the flip-chip bonded MEMS device and the substrate, cooling after bonding can cause the MEMS to buckle. Combine TAIZ theory with the flexure design in CAD to solve the problem. It can be obtained that increasing fold length can reduce warpage. By solving the deformation problem of MEMS devices can facilitate the development of flip chip technology, and make for the further application of the TRIZ theory in the study of remote sensing equipment.展开更多
基金supported by the Fundamental Research Funds for the Central Universities (DL12EB01-02, DL12CB05) and Heilongjiang Postdoctoral Fund (Grant No. LBH-Z11277) and Natrual Science Foundation for Returness of Heilongjiang Province of China (LC2011C25).
文摘Satellite remote sensing technology[1] is widely used in all walks of life ,which plays an increasingly remarkable results in natural disasters(sudden and major).With more and more launch and application of high resolution satellite, the texture information in remote sensing imagery becomes much more abundant. In the age of big data, for the infrared remote sensor has short life, which annoys many people. In the packaging process, due to a difference in thermal expansion coefficients [2] between the flip-chip bonded MEMS device and the substrate, cooling after bonding can cause the MEMS to buckle. Combine TAIZ theory with the flexure design in CAD to solve the problem. It can be obtained that increasing fold length can reduce warpage. By solving the deformation problem of MEMS devices can facilitate the development of flip chip technology, and make for the further application of the TRIZ theory in the study of remote sensing equipment.
