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Effect of Pt Addition on the Stress of NiSi Film Formed on Si (100)
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作者 黄巍 茹国平 +4 位作者 detavernier c Van Meirhaeghe R L 蒋玉龙 屈新萍 李炳宗 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第5期635-639,共5页
In order to clarify the effect of pt addition on the stress of NiSi film, in situ stress measurements were taken to evaluate the stress evolution during heating and cooling treatment of Ni1- x Ptx Si alloy films with ... In order to clarify the effect of pt addition on the stress of NiSi film, in situ stress measurements were taken to evaluate the stress evolution during heating and cooling treatment of Ni1- x Ptx Si alloy films with different Pt concentrations. The room temperature stress, which is mainly thermal stress, was measured to be 775MPa and 1.31GPa for pure NiSi and pure PtSi films grown on Si (100) substrates,respectively. For Ni1-x Ptx Si alloy film, the room temperature stress was observed to increase steadily with Pt concentration. From the temperature dependent stress evolution curves,the stress relaxation temperature was found to increase from 440℃ (for pure NiSi film) to 620℃ (for pure PtSi film) with increasing Pt concentration, thus influencing the residual stress at room temperature. 展开更多
关键词 NiSi Ni1- x Ptx Si stress
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