Bionic adhesives with tip-expanded microstructural arrays have attracted considerable interest owing to their high adhesive performance at low preloads.Their mainstream manufacturing method is molding.Due to most mold...Bionic adhesives with tip-expanded microstructural arrays have attracted considerable interest owing to their high adhesive performance at low preloads.Their mainstream manufacturing method is molding.Due to most molds are made of silicon or silicon-based soft templates,and have poor wear resistant or vulnerability to high temperature,limiting their use in large-scale manufacturing.Nickel is widely used as an embossing mold in the micro/nano-imprint industrial process owing to its good mechanical properties.However,the processing of metal molds for the fabrication of tip-expanded microstructural arrays is extremely challenging.In this study,using electrodeposition techniques,the shape of the micropores is modified to obtain end-controlled pores.The effect of the non-uniformity of the electric field on the microporous morphology in the electrodeposition process is systematically investigated.Furthermore,the mechanism of non-uniformity evolution of the microporous morphology is revealed.The optimized microporous metal array is used as a mold to investigate the cavity evolution laws of the elastic cushions under pre-load during the manufacturing process.As a result,typical bionic adhesives with tip-expansion are obtained.Moreover,corresponding adhesion mechanics are analyzed.The results show that electrochemical modifications have broad application prospects in the fabrication of tip-expanded microstructures,providing a new method for the large-scale fabrication of bionic adhesives based on metal molds.展开更多
基金the Natural Science Foundation of Jiangsu Province of China(No.BK20170796)the foundation of‘‘Jiangsu Provincial Key Laboratory of Bionic Functional Materials”of China(No.NJ2020026)+1 种基金the foundation of National Defense Key Laboratory of China(No.6142004190204)the National Natural Science Foundation of China(No.52075249)。
文摘Bionic adhesives with tip-expanded microstructural arrays have attracted considerable interest owing to their high adhesive performance at low preloads.Their mainstream manufacturing method is molding.Due to most molds are made of silicon or silicon-based soft templates,and have poor wear resistant or vulnerability to high temperature,limiting their use in large-scale manufacturing.Nickel is widely used as an embossing mold in the micro/nano-imprint industrial process owing to its good mechanical properties.However,the processing of metal molds for the fabrication of tip-expanded microstructural arrays is extremely challenging.In this study,using electrodeposition techniques,the shape of the micropores is modified to obtain end-controlled pores.The effect of the non-uniformity of the electric field on the microporous morphology in the electrodeposition process is systematically investigated.Furthermore,the mechanism of non-uniformity evolution of the microporous morphology is revealed.The optimized microporous metal array is used as a mold to investigate the cavity evolution laws of the elastic cushions under pre-load during the manufacturing process.As a result,typical bionic adhesives with tip-expansion are obtained.Moreover,corresponding adhesion mechanics are analyzed.The results show that electrochemical modifications have broad application prospects in the fabrication of tip-expanded microstructures,providing a new method for the large-scale fabrication of bionic adhesives based on metal molds.
