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Films surface temperature calculation during growth by sputtering technique
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作者 f.khelfaoui M.S.Aida 《Journal of Semiconductors》 EI CAS CSCD 2017年第9期82-85,共4页
A calculation of film surface temperature during thin films growth by sputtering technique is proposed. The calculation procedure is based on the conversion into heat of the total flux energy of species impinging the ... A calculation of film surface temperature during thin films growth by sputtering technique is proposed. The calculation procedure is based on the conversion into heat of the total flux energy of species impinging the film surface during growth. The results indicate that the film's surface temperature depends drastically on material substrate thermal conductivity and thickness on one hand, and the plasma conditions namely the discharge power on the other. The predicted film surface temperatures were used to explain the microstructure evolution of hydro- genated amorphous silicon (a-Si:H) thin films deposited by reactive radio frequency (RF) sputtering on different substrates. 展开更多
关键词 sputtering deposition PLASMA amorphous silicon thin films
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