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Organic Memristor Based on High Planar Cyanostilbene/Polymer Composite Films 被引量:1
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作者 ZHAO Jinjin LI Wei +8 位作者 WANG Xuechen WEI Xiao ZHU Huiwen QU Wenshan MEN Dandan gao Zhixiang WEI Bin gao hanfei WU Yuchen 《Chemical Research in Chinese Universities》 SCIE CAS CSCD 2023年第1期121-126,共6页
Organic memristors with low power consumption,fast write/erasure speed,and complementary metal-oxide-semiconductor(CMOS)compatibility have attracted tremendous attention to mimic biological synapses to realize neuromo... Organic memristors with low power consumption,fast write/erasure speed,and complementary metal-oxide-semiconductor(CMOS)compatibility have attracted tremendous attention to mimic biological synapses to realize neuromorphic computation in recent years.In this paper,organic resistive switching memory(ORSM)based on(Z)-3-(naphthalen-2-yl)-2-(4-nitrophenyl)acrylonitrile(NNA)and polymer poly(N-vinylcarbazole)(PVK)composite film was prepared by spin-coating method.Device performance based on NNA:PVK composite films with different mass fractions of NNA were systematically investigated.The ORSM based on PVK:40%(mass fraction)NNA composite film exhibited non-volatile and bipolar memory properties with a switching ratio(Ion/Ioff)of 24.1,endurance of 68 times and retention time of 104 s,a“SET”voltage(Vset)of−0.55 V and a“RESET”voltage(Vreset)of 2.35 V.The resistive switching was ascribed to the filling and vacant process of the charge traps induced by NNA and the inherent traps in PVK bulk.The holes trapping and de-trapping process occurred when the device was applied with a negative or positive bias,which caused the transforming of the conductive way of charges,that is the resistive behaviors in the macroscopic.This study provides a promising platform for the fabrication of ORSM with high performance. 展开更多
关键词 Organic memristor Resistive switching Polymer/molecule composite film
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纯钼薄板的温变形行为及本构建模 被引量:2
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作者 代鹏 高晗菲 +2 位作者 王宁 樊晓光 孙明明 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2021年第4期1156-1165,共10页
纯钼薄板在航天领域中有很好的应用前景,而准确表征纯钼板在温热条件下的力学性能是明确钼构件成形性的必要条件。因此,基于在不同温度(20~500℃)和应变速率(5×10^(-4)~1×10^(-2)s^(-1))条件下进行的拉伸试验,对纯钼薄板的流... 纯钼薄板在航天领域中有很好的应用前景,而准确表征纯钼板在温热条件下的力学性能是明确钼构件成形性的必要条件。因此,基于在不同温度(20~500℃)和应变速率(5×10^(-4)~1×10^(-2)s^(-1))条件下进行的拉伸试验,对纯钼薄板的流动应力行为、厚向异性和断裂行为进行了研究。结果表明,纯钼薄板的变形抗力对温度敏感,同时,厚向异性指数r随温度变化较小。应变硬化指数从室温到300℃呈显著增大趋势,之后随着温度升高而趋于稳定。随着温度升高,纯钼薄板的断裂延伸率先升高后略减小。裂纹产生于晶界,随后晶粒沿着晶间裂纹的分离导致断口分层现象的产生。建立了修正的Johnson-Cook纯钼薄板本构模型,模型平均误差低于5%。 展开更多
关键词 纯钼板 变形行为 厚向异性 断裂 本构模型
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