Metal oxide thin films for soft and flexible electronics require low cost,room temperature fabrication,and structuring processes.We here introduce an anodic printing process to realize the essential building blocks of...Metal oxide thin films for soft and flexible electronics require low cost,room temperature fabrication,and structuring processes.We here introduce an anodic printing process to realize the essential building blocks of electronic circuitry,including resistors,capacitors,field-effect transistors,diodes,rectifiers,and memristors directly on imperceptible plastic substrates.Largely independent on surface properties,we achieve high-quality,few nanometer thin dielectric and semiconducting films even on rough substrates via localized anodisation of valve metals using a scanning droplet cell microscope.We demonstrate printing-like fabrication of 3D multilayer solid-state capacitors with a record-high areal capacity of 4μF cm−2.Applicable to the whole class of valve metals and their alloys,our method provides a versatile fabrication technique for the circuits that empower the flexible and stretchable electronics of tomorrow.展开更多
基金Work supported by the ERC Advanced Investigators Grant‘Soft-Map’under grant agreement no.291429the ERC Starting Grant‘GEL-SYS’under grant agreement no.757931+3 种基金startup funding of the Linz Institute of Technology under grant no.LIT013144001SELthe JST Someya Bio-Harmonized ERATO grantFinancial support by the Austrian Federal Ministry of Science,Research and Economy and the National Foundation for Research,Technology and Development through funding of the Christian Doppler Laboratory for Combinatorial Oxide Chemistry(COMBOX)is gratefully acknowledgedAdditional funding was provided by an IEEE/DEIS Graduate Student Award of C.M.Siket,a Macke mobility scholarship,the regional government(Land OO),and the‘Forschungsförderung’of JKU.
文摘Metal oxide thin films for soft and flexible electronics require low cost,room temperature fabrication,and structuring processes.We here introduce an anodic printing process to realize the essential building blocks of electronic circuitry,including resistors,capacitors,field-effect transistors,diodes,rectifiers,and memristors directly on imperceptible plastic substrates.Largely independent on surface properties,we achieve high-quality,few nanometer thin dielectric and semiconducting films even on rough substrates via localized anodisation of valve metals using a scanning droplet cell microscope.We demonstrate printing-like fabrication of 3D multilayer solid-state capacitors with a record-high areal capacity of 4μF cm−2.Applicable to the whole class of valve metals and their alloys,our method provides a versatile fabrication technique for the circuits that empower the flexible and stretchable electronics of tomorrow.
