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多层LCP基板中宽带槽线耦合结构的设计与实现
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作者 刘维红 关东阳 +1 位作者 黄倩 张璇 《电子元件与材料》 CAS CSCD 北大核心 2022年第12期1318-1323,共6页
槽线耦合结构作为多层电路结构中的核心单元,其特性直接决定整个系统性能的优劣。基于三层LCP基板设计了一款Ka波段宽带微带线-槽线-微带线垂直耦合结构,通过接地层的槽线结构实现了异面微带线间信号传输。仿真结果显示,在23~43.62 GHz... 槽线耦合结构作为多层电路结构中的核心单元,其特性直接决定整个系统性能的优劣。基于三层LCP基板设计了一款Ka波段宽带微带线-槽线-微带线垂直耦合结构,通过接地层的槽线结构实现了异面微带线间信号传输。仿真结果显示,在23~43.62 GHz的通带内,该结构的插入损耗约为-1 dB,回波损耗优于-16 dB。为进一步改善槽线耦合结构的传输特性,创新性地在四层LCP基板底层加载3 mm×1 mm的开路枝节线,在24.45~41.93 GHz频段内插入损耗约为-0.95 dB,回波损耗优于-21 dB。基于LCP多层板技术,制备了槽线耦合结构,测试结果显示,该结构在23.16~40.35 GHz频率范围之内,插入损耗约为-2 dB,回波损耗优于-14 dB。该研究将为多层LCP基板在微波毫米波射频系统集成方面的应用提供实验依据。 展开更多
关键词 多层LCP技术 宽带传输特性 槽线耦合 开路枝节线
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W-band millimeter wave vialess microstrip-to-microstrip vertical transition in multilayer LCP substrate
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作者 Liu Weihong Zhang Xu guan dongyang 《The Journal of China Universities of Posts and Telecommunications》 EI CSCD 2024年第3期87-94,共8页
In this paper,a W-band broadband vialess microstrip(MS)-to-MS vertical transition in multilayer liquid crystal polymer(LCP)substrate is presented,which consists of two MS lines in the top layer,a common ground plane a... In this paper,a W-band broadband vialess microstrip(MS)-to-MS vertical transition in multilayer liquid crystal polymer(LCP)substrate is presented,which consists of two MS lines in the top layer,a common ground plane and slotline resonators in the second layer,and a close-loop transmission-line in the third layer.To increase the passband of the vialess vertical transition,an H-shaped slotline resonator is introduced,which greatly improves the impedance performance of the slotline resonator,and the full-wave simulated results indicate that insertion loss(IL)is less than 2 dB and return loss(RL)is better than 10 dB at W-band.To verify this design,the broadband vertical transition is fabricated and measured.The measured results indicate that a broadband vertical transition with RL better than 10 dB and IL less than 5.67 dB can be obtained in the frequency range from 70.00 GHz to 104.09 GHz.Due to the fabrication error in the preparation process,the measured results are deteriorated compared to the simulated results,and the investigation indicates that the deviation is caused by the thickness error of the LCP substrate. 展开更多
关键词 W-BAND broadband microstrip(MS)-to-MS vialess vertical transition liquid crystal polymer(LCP)
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