It is important to determine quantitatively the internal carrier loss arising from heating and barrier height variation in a vertical-cavity surface-emitting quantum well laser （VCSEL）. However, it is generally diff...It is important to determine quantitatively the internal carrier loss arising from heating and barrier height variation in a vertical-cavity surface-emitting quantum well laser （VCSEL）. However, it is generally difficult to realize this goal using purely theoretical formulas due to difficulty h, deriving the parameters relat^i~g to the quantum well structure. In this paper, we describe an efl：icient approach to characterizing and calculating the carrier loss due to the heating and the barrier height change in the VCSEL. In the method, the thermal carrier loss mechanism is combined with gain measurement and calculation. The carrier loss is re-characterized in a calculable form by constructing the threshold current and gain detuning-related loss current using the measured gain data and then substituting them for the quantum well-related parameters in the formula. The result can be expressed as a product of an exponential weight factor linked to the barrier height change and the difference between the threshold current and gain detuning-related loss current. The gain variation at cavity frequency due to thermal carrier loss and gain detuning processes is measured by using an AllnGaAs-AIGaAs VCSEL structure. This work provides a useful approach to analysing threshold and loss properties of the VCSEL, particularly, gain offset design for high temperature operation of VCSELs.展开更多
The intrinsic features involving a circularly symmetric beam profile with low divergence, planar geometry as well as the increasingly enhanced power of vertical-cavity surface-emitting lasers （VCSELs） have made the ...The intrinsic features involving a circularly symmetric beam profile with low divergence, planar geometry as well as the increasingly enhanced power of vertical-cavity surface-emitting lasers （VCSELs） have made the VCSEL a promising pump source in direct end bonding to a solid-state laser medium to form the minimized, on-wafer integrated laser system. This scheme will generate a surface contact pump configuration and thus additional end thermal coupling to the laser medium through the joint interface of both materials, apart from pump beam heating. This paper analytically models temperature distributions in both VCSEL and the laser medium from the end thermal coupling regarding surface contact pump configuration using a top-emitting VCSEL as the pump source for the first time. The analytical solutions are derived by introducing relative temperature and mean temperature expressions. The results show that the end contact heating by the VCSEL could lead to considerable temperature variations associated with thermal phase shift and thermal lensing in the laser medium. However, if the central temperature of the interface is increased by less than 20 K, the end contact heating does not have a significant thermal influence on the laser medium. In this case, the thermal effect should be dominated by pump beam heating. This work provides useful analytical results for further analysis of hybrid thermal effects on those lasers pumped by a direct VCSEL bond.展开更多
文摘It is important to determine quantitatively the internal carrier loss arising from heating and barrier height variation in a vertical-cavity surface-emitting quantum well laser （VCSEL）. However, it is generally difficult to realize this goal using purely theoretical formulas due to difficulty h, deriving the parameters relat^i~g to the quantum well structure. In this paper, we describe an efl：icient approach to characterizing and calculating the carrier loss due to the heating and the barrier height change in the VCSEL. In the method, the thermal carrier loss mechanism is combined with gain measurement and calculation. The carrier loss is re-characterized in a calculable form by constructing the threshold current and gain detuning-related loss current using the measured gain data and then substituting them for the quantum well-related parameters in the formula. The result can be expressed as a product of an exponential weight factor linked to the barrier height change and the difference between the threshold current and gain detuning-related loss current. The gain variation at cavity frequency due to thermal carrier loss and gain detuning processes is measured by using an AllnGaAs-AIGaAs VCSEL structure. This work provides a useful approach to analysing threshold and loss properties of the VCSEL, particularly, gain offset design for high temperature operation of VCSELs.
文摘The intrinsic features involving a circularly symmetric beam profile with low divergence, planar geometry as well as the increasingly enhanced power of vertical-cavity surface-emitting lasers （VCSELs） have made the VCSEL a promising pump source in direct end bonding to a solid-state laser medium to form the minimized, on-wafer integrated laser system. This scheme will generate a surface contact pump configuration and thus additional end thermal coupling to the laser medium through the joint interface of both materials, apart from pump beam heating. This paper analytically models temperature distributions in both VCSEL and the laser medium from the end thermal coupling regarding surface contact pump configuration using a top-emitting VCSEL as the pump source for the first time. The analytical solutions are derived by introducing relative temperature and mean temperature expressions. The results show that the end contact heating by the VCSEL could lead to considerable temperature variations associated with thermal phase shift and thermal lensing in the laser medium. However, if the central temperature of the interface is increased by less than 20 K, the end contact heating does not have a significant thermal influence on the laser medium. In this case, the thermal effect should be dominated by pump beam heating. This work provides useful analytical results for further analysis of hybrid thermal effects on those lasers pumped by a direct VCSEL bond.
