随着雷达性能指标不断提高、体积不断压缩,作为其关键组成部分成之一的T/R(transmitter and receiver)组件也不断向小型化和高密度方向发展.采用超高密度引线键合技术能够实现高密度射频器件封装,但也会带来键合焊点可靠性下降、电路射...随着雷达性能指标不断提高、体积不断压缩,作为其关键组成部分成之一的T/R(transmitter and receiver)组件也不断向小型化和高密度方向发展.采用超高密度引线键合技术能够实现高密度射频器件封装,但也会带来键合焊点可靠性下降、电路射频性能差等问题.针对键合线尺寸减小而引起射频性能下降的问题,采用HFSS软件探究了在0~20 GHz金带尺寸变化对电路射频性能的影响规律,并利用ANSYS Q3D和ADS软件对超细引线键合的电路进行阻抗匹配.结果表明,对于金丝和金带而言,插入微带双枝短截线匹配结构均能明显提高电路的射频性能.对于类型1结构,S21与S12的传输功率能达到-0.049 dB.对于类型2结构,S21与S12的传输功率能达到-7.245×10-5 dB,说明类型2结构下的信号传输几乎无损耗.该结果为超细引线键合技术在射频电路中的应用提供了理论指导.展开更多
作为有源相控阵雷达的关键组成部分,T/R(Transmitter and receiver)组件的尺寸与性能决定着装备的重量和功能。引线键合是T/R组件中常用的互连技术之一,随着组件集成度的提高势必也要开发相应的高密度引线键合技术,这使得键合线的尺寸...作为有源相控阵雷达的关键组成部分,T/R(Transmitter and receiver)组件的尺寸与性能决定着装备的重量和功能。引线键合是T/R组件中常用的互连技术之一,随着组件集成度的提高势必也要开发相应的高密度引线键合技术,这使得键合线的尺寸越来越小,而超细的引线会使焊点力学性能降低,造成可靠性下降等问题。采用超声热压楔形键合的方法实现了的超细金丝与金焊盘的连接,并对工艺进行优化。结果表明,随键合压力、键合时间和超声功率的增大,键合后引线形变量逐渐增大,而键合后金丝的拉力先增加后减小,且工艺参数对金带形变量的影响小于金丝;由于第二焊点作用力过大会导致引线形变量较大、最大拉力小于第一焊点,需增加题焊点数量;最后,通过正交试验方法获得了金线和金带的最佳键合工艺参数,实现了超细尺寸引线的键合,对T/R组件的小型化具有重要意义。展开更多
Transparent conductive films(TCFs)have attracted intense attention in many electronic products,such as flexible devices,organic light-emitting diodes and stretchable electronics.Indium tin oxide(ITO)is the most common...Transparent conductive films(TCFs)have attracted intense attention in many electronic products,such as flexible devices,organic light-emitting diodes and stretchable electronics.Indium tin oxide(ITO)is the most commonly used transparent conductive material.However,the instinct brittleness,low reserves and high manufacturing costs associated with ITO prompted searching for a suitable alternative.The alternatives are expected to have a comparable optoelectrical performance with ITO,excellent flexibility and low cost.At present,metal nanowires(NWs)are the only alternative to ITO that satisfy these requirements concurrently.Nevertheless,practical applications of metal NWs are still limited by several drawbacks,including the poor quality of synthesized NWs,the loose wire to wire junctions,and the low resistance against oxidation or corrosion.This review summarizes the recent developments of TCFs to address these challenging issues and highlights some most important fabrication methods to improve the conductivity and stability of TCFs.At last,the applications of TCFs in a variety of devices,such as transparent heaters,organic light-emitting diodes and electrochromic devices,are also discussed.展开更多
文摘作为有源相控阵雷达的关键组成部分,T/R(Transmitter and receiver)组件的尺寸与性能决定着装备的重量和功能。引线键合是T/R组件中常用的互连技术之一,随着组件集成度的提高势必也要开发相应的高密度引线键合技术,这使得键合线的尺寸越来越小,而超细的引线会使焊点力学性能降低,造成可靠性下降等问题。采用超声热压楔形键合的方法实现了的超细金丝与金焊盘的连接,并对工艺进行优化。结果表明,随键合压力、键合时间和超声功率的增大,键合后引线形变量逐渐增大,而键合后金丝的拉力先增加后减小,且工艺参数对金带形变量的影响小于金丝;由于第二焊点作用力过大会导致引线形变量较大、最大拉力小于第一焊点,需增加题焊点数量;最后,通过正交试验方法获得了金线和金带的最佳键合工艺参数,实现了超细尺寸引线的键合,对T/R组件的小型化具有重要意义。
基金supported by the National Natural Science Foundation of China(Grant No.51522503)the National Key R&D Program of China(Grant No.2018YFB1307501)。
文摘Transparent conductive films(TCFs)have attracted intense attention in many electronic products,such as flexible devices,organic light-emitting diodes and stretchable electronics.Indium tin oxide(ITO)is the most commonly used transparent conductive material.However,the instinct brittleness,low reserves and high manufacturing costs associated with ITO prompted searching for a suitable alternative.The alternatives are expected to have a comparable optoelectrical performance with ITO,excellent flexibility and low cost.At present,metal nanowires(NWs)are the only alternative to ITO that satisfy these requirements concurrently.Nevertheless,practical applications of metal NWs are still limited by several drawbacks,including the poor quality of synthesized NWs,the loose wire to wire junctions,and the low resistance against oxidation or corrosion.This review summarizes the recent developments of TCFs to address these challenging issues and highlights some most important fabrication methods to improve the conductivity and stability of TCFs.At last,the applications of TCFs in a variety of devices,such as transparent heaters,organic light-emitting diodes and electrochromic devices,are also discussed.
