This research has successfully developed an advance d manufacturing system for 300mm silicon wafer,using fixed abrasive instead o f conventional free slurry,to provide a totally integrated solution for achievi ng the ...This research has successfully developed an advance d manufacturing system for 300mm silicon wafer,using fixed abrasive instead o f conventional free slurry,to provide a totally integrated solution for achievi ng the surface roughness Ra<1 nm(Ry<5～6 nm) and the global flatness<O.2μm /300 mm.In addition to high throughput rate,this system significantly reduc es the total energy consumption by 70%,compared with the current process used for 200mm Si wafer.This paper describes the principle of material removal,st ate-of-the-art technologies and kinematical analysis for one-stop finishing o f 300mm Si wafer by fixed abrasive process.展开更多
文摘This research has successfully developed an advance d manufacturing system for 300mm silicon wafer,using fixed abrasive instead o f conventional free slurry,to provide a totally integrated solution for achievi ng the surface roughness Ra<1 nm(Ry<5～6 nm) and the global flatness<O.2μm /300 mm.In addition to high throughput rate,this system significantly reduc es the total energy consumption by 70%,compared with the current process used for 200mm Si wafer.This paper describes the principle of material removal,st ate-of-the-art technologies and kinematical analysis for one-stop finishing o f 300mm Si wafer by fixed abrasive process.
