Multiple factors influencing high-purity indium electrolytic refining

The effects of various contaminants in the electrolytic refinement of indium were investigated using a glow discharge mass spectrometer(GDMS).The effects of several factors such as the indium ion(In3+)concentration,the sodium chloride(NaCl)concentration,the current density,the gelatin concentration,the pH,and the electrode distance,were examined.Significant variations in impurity levels concerning gelatin concentration were observed.Both the gelatin and In3+concentration were moderately positively correlated with the Pb content.The Sb concentration was associated positively with the NaCl concentration,while the Ti concentration had an adverse correlation with the NaCl concentration.The Bi element content was positively linked to the electrode distance.As the current density increased,Cu,Pb,and Bi impurities initially rose and then eventually declined.Notably,a critical current density of 45 A·m^(-2) was identified in this behavior.

Relationship between La and Ce additions on microstructure and corrosion resistance of hot-dip galvanized steel

Scanning electron microscopy,X-ray diffraction,a neutral salt spray test,and electrochemical methods were applied to observe the microstructure and test the corrosion resistance of hot-dip galvanized steel before and after the addition of La and Ce.La/Ce mixture existed in the form of(La,Ce)Zn13 on the coated surface,decreased the coating thickness and accelerated the zinc dendritic growth.The corrosion current density of Zn-0.1La-0.1Ce coating was 63%less than that of pure Zn coating.This phenomenon can be explained that La/Ce mixture inhibited the transformation of Zn5(OH)8Cl2·H2O into Zn5(CO3)2(OH)6 or ZnO,reduced the time for appearance of red rust,and thus enhanced the stability of corrosion products and delayed the oxidation and corrosion processes of galvanized coating.La/Ce mixture improved the corrosion resistance compared to a single La or a single Ce addition.A competitive relationship between La and Ce was observed in the corrosion resistance improvement of hot-dip galvanized steel.

Balancing the corrosion resistance and through-plane electrical conductivity of Cr coating via oxygen plasma treatment

Developing an electrically conductive and corrosion-resistant coating is essential for metal bipolar plates of polymer electrolyte membrane fuel cells(PEMFCs). Although enhanced corrosion resistance was seen for Cr coated stainless steel(Cr/SS) bipolar plates, they experience a quick decrease of through-plane electrical conductivity due to the formation of a porous and low-conductive corrosion product layer at the plate surface, thus leading to an increase in interfacial contact resistance(ICR). To tackle this issue, the multilayer Cr coatings were deposited using the magnetron sputtering with a remote inductively coupled oxygen plasma(O-ICP) in the present study. After the O-ICP treatment, a Cr oxide layer(Cr O*) is formed on the specimen surface. The Cr O*/Cr/SS has a remarkably lower stable corrosion rate(iss) than that of the native Cr oxides(Cr On/Cr/SS). Compared with Cr On/Cr/SS, the excellent performance of Cr O*/Cr/SS is attributed to a denser and thicker surface layer of Cr O* with Cr being oxidized to its highest valence state,Cr(VI). More importantly, the through-plane electrical conductivity of the specimens treated by the optimized O-ICP decreases much slowly than Cr On/Cr/SS and thus, the increament of ICR of Cr O*/Cr/SS after the potentiostatic polarization test is considerably smaller than that of Cr On/Cr/SS, which is benefited from the reduced issthat mitigates the deposition of corrosion products and hinders further oxidation of Cr coating. Therefore, Cr O*/Cr/SS proves to be a well balanced trade-off between corrosion resistance and through-plane electrical conductivity. The results of this study demonstrate that O-ICP treatment on a conductive metal coating is an effective strategy to improve the corrosion resistance and suppress the increase of ICR over the long-term polarization. The technique reported herein exhibits its promising potential application in preparing corrosion resistant and electrically conductive coatings on metal bipolar plates to be used in PEMFCs.