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Dynamic Constitutive Model of Physical Simulation in High-Speed Blanking for C5191 Phosphor Bronze
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作者 hu daochun Chen Minghe +1 位作者 Wang Lei Yin Liming 《Transactions of Nanjing University of Aeronautics and Astronautics》 EI CSCD 2018年第6期1010-1017,共8页
Strain hardening,strain rate strengthening and thermal softening data of C5191 phosphor bronze at highspeed blanking are not easy to be obtained with a general measure method,therefore,it is quite difficult to establi... Strain hardening,strain rate strengthening and thermal softening data of C5191 phosphor bronze at highspeed blanking are not easy to be obtained with a general measure method,therefore,it is quite difficult to establish the dynamic constitutive model.To solve this problem,the tensile properties at a strain rate of 1 s^(-1) by GLEEBLE-3500,and dynamic tensile conditions at strain rates of 500,1 000 and 1 500 s^(-1) by split Hopkinson tensile bar (SHTB) apparatus are studied.According to these test data,the classic Johnson-Cook equation is modified.Furthermore,the modified Johnson-Cook equation is validated in the physical simulation model of high-speed blanking.The results show that the strength of C5191 phosphor bronze maintains a certain degree of increase as the strain rate increasing and presents a clear sensitivity to strain rate.The modified Johnson-Cook equation,which has better description accuracy than the classical Johnson-Cook equation,can provide important material parameters for physical simulation models of its high-speed blanking process. 展开更多
关键词 C5191 PHOSPHOR BRONZE SPLIT Hopkinson tensile bar(SHTB) Johnson-Cook equation dynamic CONSTITUTIVE model HIGH-SPEED BLANKING
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金刚石/铜复合材料的SPS扩散连接界面组织及力学性能
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作者 王蕾 胡道春 +2 位作者 陈明和 冯绍辉 周颖 《特种铸造及有色合金》 CAS 北大核心 2024年第1期121-126,共6页
对金刚石/铜复合材料进行SPS扩散连接试验,并对其连接接头进行了界面扩散分析和剪切性能测试,研究了SPS扩散连接工艺参数对连接界面组织和力学性能的影响。结果表明,随着连接温度升高和保温时间增加,金刚石/铜连接接头扩散界面区域的孔... 对金刚石/铜复合材料进行SPS扩散连接试验,并对其连接接头进行了界面扩散分析和剪切性能测试,研究了SPS扩散连接工艺参数对连接界面组织和力学性能的影响。结果表明,随着连接温度升高和保温时间增加,金刚石/铜连接接头扩散界面区域的孔洞和空隙等缺陷减少,元素扩散充分,W逐渐向Cu方向扩散,与母材相比,连接界面W2C相和W相减少。随着扩散连接品质提升,热导率随之增加,焊接接头的最大剪切力和剪切强度增大,剪切断面形貌逐渐产生大量解理面和断裂台阶,并伴有少量撕裂棱,断裂机制由脆性过渡到半解理韧性断裂。扩散温度为750℃,保温时间为90 min时,连接界面整体扩散结合品质较高,剪切强度达到48.83 MPa,热导率为347.73 W/(m·K)。 展开更多
关键词 金刚石/铜复合材料 SPS 界面连接 力学性能 导热性能
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