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电沉积Mo和Mo-Co合金纳米线用于互联电阻的电阻率改性
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作者 Jun Hwan moon Taesoon Kim +6 位作者 Youngmin lee Seunghyun Kim Yanghee Kim Jae-Pyoung Ahn Jungwoo Choi hyuck mo lee Young Keun Kim 《Engineering》 SCIE EI CAS CSCD 2024年第1期127-137,共11页
Achieving historically anticipated improvement in the performance of integrated circuits is challenging,due to the increasing cost and complexity of the required technologies with each new generation.To overcome this ... Achieving historically anticipated improvement in the performance of integrated circuits is challenging,due to the increasing cost and complexity of the required technologies with each new generation.To overcome this limitation,the exploration and development of novel interconnect materials and processes are highly desirable in the microelectronics field.Molybdenum(Mo)is attracting attention as an advanced interconnect material due to its small resistivity size effect and high cohesive energy;however,effective processing methods for such materials have not been widely investigated.Here,we investigate the electrochemical behavior of ions in the confined nanopores that affect the electrical properties and microstructures of nanoscale Mo and Mo-Co alloys prepared via template-assisted electrodeposition.Additives in an electrolyte allow the deposition of extremely pure metal materials,due to their interac-tion with metal ions and nanopores.In this study,boric acid and tetrabutylammonium bisulfate(TBA)were added to an acetate bath to inhibit the hydrogen evolution reaction.TBA accelerated the reduction of Mo at the surface by inducing surface conduction on the nanopores.Metallic Mo nanowires with a 130 nm diameter synthesized through high-aspect-ratio nanopore engineering exhibited a resistivity of(63.0±17.9)μΩcm.We also evaluated the resistivities of Mo-Co alloy nanowires at various compo-sitions toward replacing irreducible conventional barrier/liner layers.An intermetallic compound formed at a Mo composition of 28.6 at%,the resistivity of the Mo-Co nanowire was(58.0±10.6)μΩcm,indicat-ing its superior electrical and adhesive properties in comparison with those of conventional barriers such as TaN and TiN.Furthermore,density functional theory and non-equilibrium Green's function calcula-tions confirmed that the vertical resistance of the via structure constructed from Mo-based materials was 21%lower than that of a conventional Cu/Ta/TaN structure. 展开更多
关键词 MOLYBDENUM Molybdenum-cobalt INTERCONNECT Microstructure ELECTRODEPOSITION Density functional theory
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Intimate atomic Cu-Ag interfaces for high CO2RR selectivity towards CH4 at low over potential 被引量:9
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作者 Chungseok Choi Jin Cai +3 位作者 Changsoo lee hyuck mo lee Mingjie Xu Yu Huang 《Nano Research》 SCIE EI CSCD 2021年第10期3497-3501,共5页
Developing highly efficient electrochemical catalysts for carbon dioxide reduction reaction(CO_(2)RR)provides a solution to battle global warming issues resulting from ever-increasing carbon footprint due to human act... Developing highly efficient electrochemical catalysts for carbon dioxide reduction reaction(CO_(2)RR)provides a solution to battle global warming issues resulting from ever-increasing carbon footprint due to human activities.Copper(Cu)is known for its efficiency in CO_(2)RR towards value-added hydrocarbons;hence its unique structural properties along with various Cu alloys have been extensively explored in the past decade.Here,we demonstrate a two-step approach to achieve intimate atomic Cu-Ag interfaces on the surface of Cu nanowires,which show greatly improved CO_(2)RR selectivity towards methane(CH4).The specially designed Cu-Ag interfaces showed an impressive maximum Faradaic efficiency(FE)of 72%towards CH4 production at-1.17 V(vs.reversible hydrogen electrode(RHE)). 展开更多
关键词 electrochemical CO_(2)reduction reaction catalyst copper silver bimetallic interface
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Fabrication of sintering-free flexible copper nanowire/ polymer composite transparent electrodes with enhanced chemical and mechanical stability 被引量:6
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作者 Cho Rong Chu Changsoo lee +1 位作者 Jahyun Koo hyuck mo lee 《Nano Research》 SCIE EI CAS CSCD 2016年第7期2162-2173,共12页
The thermal decomposition synthesis of long copper nanowires (CuNWs) was achieved by controlling the synthesis parameters. A detailed study was performed to determine the effect of the molar ratio of copper chloride... The thermal decomposition synthesis of long copper nanowires (CuNWs) was achieved by controlling the synthesis parameters. A detailed study was performed to determine the effect of the molar ratio of copper chloride to nickel acetylacetonate, temperature, and stirring rate on the final shape of the products. Transparent electrodes (TEs) were fabricated by wet treatment with acetic acid (AA), without using a sintering process. The low oxidation stability and high surface roughness are the main disadvantages of the CuNW TEs, which limit their applications. In order to overcome these issues, we prepared CuNW/polymer composite TEs by partial embedding of the CuNWs into poly(methyl methacrylate) (PMMA) on poly(ethylene terephthalate) (PET) substrates. The CuNW/PMMA composite TEs exhibit excellent optoelectronic performance (91.3% at 100.7 ff2/sq), low surface roughness (4.6 nm in height), and good mechanical and chemical stability as compared with CuNW TEs. On the basis of these properties, we believe that CuNW-based composite TEs could serve as low-cost materials for a wide range of new optoelectronic devices. 展开更多
关键词 copper nanowires nanowire/polymercomposite transparent electrode chemical stability mechanical stability
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