In West Java, Indonesia, ram fighting is popular and champions in such a fight would cost up to 30 million rupiah (approximately RMB 30,000)each.Indonesia celebrated its 57th Independence Day on 17th August 2002. The ...In West Java, Indonesia, ram fighting is popular and champions in such a fight would cost up to 30 million rupiah (approximately RMB 30,000)each.Indonesia celebrated its 57th Independence Day on 17th August 2002. The picture shows two rams in a head-to-head clash at a flora and fauna fair held in Jakarta as part of the celebrations.展开更多
文摘In West Java, Indonesia, ram fighting is popular and champions in such a fight would cost up to 30 million rupiah (approximately RMB 30,000)each.Indonesia celebrated its 57th Independence Day on 17th August 2002. The picture shows two rams in a head-to-head clash at a flora and fauna fair held in Jakarta as part of the celebrations.
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随着移动消费型电子产品对于小型化,功能集成以及大存储空间的要求的进一步提升,元器件的小型化高密度封装形式也越来越多,如多模块封装(MCM),系统封装(SiP),倒装晶片等应用得越来越多。而元件堆叠装配(PoP,Package on Package)技术的出现更加模糊了一级封装与二级装配之间的界线,在大大提高逻辑运算功能和存储空间的同时,