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Poly dimethylsiloxane/carbon nanofiber nanocomposites: fabrication and characterization of electrical and thermal properties 被引量:1
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作者 Shoieb Chowdhury Mark Olima +3 位作者 Yingtao Liu Mrinal Saha james bergman Thomas Robison 《International Journal of Smart and Nano Materials》 SCIE EI 2016年第4期236-247,共12页
This article presents the fabrication and characterization of poly dimethylsiloxane/carbon nanofiber(CNF)-based nanocomposites.Although silica and carbon nanoparticles have been traditionally used to reinforce mechani... This article presents the fabrication and characterization of poly dimethylsiloxane/carbon nanofiber(CNF)-based nanocomposites.Although silica and carbon nanoparticles have been traditionally used to reinforce mechanical properties in PDMS matrix nanocom-posites,this article focuses on understanding their impacts on electrical and thermal properties.By adjusting both the silica and CNF concentrations,12 different nanocomposite formulations were studied,and the thermal and electrical properties of these materials were experimentally characterized.The developed nano-composites were prepared using a solvent-assisted method pro-viding uniform dispersion of the CNFs in the polymer matrix.Scanning electron microscopy was employed to determine the dispersion of the CNFs at different length scales.The thermal properties,such as thermal stability and thermal diffusivity,of the developed nanocomposites were studied using thermogravi-metirc and laser flash techniques.Furthermore,the electrical volume conductivity of each type of nanocomposite was tested using the four-probe method to eliminate the effects of contact electrical resistance during measurement.Experimental results showed that both CNFs and silica were able to impact on the overall properties of the synthesized PDMS/CNF nanocomposites.The developed nanocomposites have the potential to be applied to the development of new load sensors in the future. 展开更多
关键词 NANOCOMPOSITES poly dimethylsiloxane carbon nanofiber electrical conductivity thermal stability thermal diffusivity
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