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Classifying Abdominal Fat Distribution Patterns byUsing Body Measurement Data
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作者 Jingjing Sun Bugao Xu +1 位作者 jane lee Jeanne H.Freeland-Graves 《Computer Modeling in Engineering & Sciences》 SCIE EI 2021年第3期1189-1202,共14页
This study aims to explore new categorization that characterizes the distribution clusters of visceral and subcutaneous adipose tissues(VAT and SAT)measured by magnetic resonance imaging(MRI),to analyze the relationsh... This study aims to explore new categorization that characterizes the distribution clusters of visceral and subcutaneous adipose tissues(VAT and SAT)measured by magnetic resonance imaging(MRI),to analyze the relationship between the VAT-SAT distribution patterns and the novel body shape descriptors(BSDs),and to develop a classifier to predict the fat distribution clusters using the BSDs.In the study,66 male and 54 female participants were scanned by MRI and a stereovision body imaging(SBI)to measure participants’abdominal VAT and SAT volumes and the BSDs.A fuzzy c-means algorithm was used to form the inherent grouping clusters of abdominal fat distributions.A support-vector-machine(SVM)classifier,with an embedded feature selection scheme,was employed to determine an optimal subset of the BSDs for predicting internal fat distributions.A fivefold cross-validation procedure was used to prevent over-fitting in the classification.The classification results of the BSDs were compared with those of the traditional anthropometric measurements and the Dual Energy X-Ray Absorptiometry(DXA)measurements.Four clusters were identified for abdominal fat distributions:(1)low VAT and SAT,(2)elevated VAT and SAT,(3)higher SAT,and(4)higher VAT.The cross-validation accuracies of the traditional anthropometric,DXA and BSD measurements were 85.0%,87.5% and 90%,respectively.Compared to the traditional anthropometric and DXA measurements,the BSDs appeared to be effective and efficient in predicting abdominal fat distributions. 展开更多
关键词 Abdominal fat distribution body shape descriptor SVM classifier
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IC设计,2D到3D平地起高楼!
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作者 王丽娟 janet Wang +1 位作者 李慧臻 jane lee 《电子与电脑》 2009年第5期34-37,共4页
3D IC是不是系统单芯片(SOC)与系统级封装(SIP)的救赎? SIP并没有完全接手SOC的技术任务,2006年开始推出3D IC概念后,2008年实作已有20万片。台湾地区目前最重要的课题是:制订3D IC的产业标准。
关键词 IC设计 3D 高楼 平地 2D 系统级封装 系统单芯片 台湾地区
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台积电市值蒸发千亿芯片业复苏还需要时间
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作者 jane lee Jeanny Yu 《商业周刊(中文版)》 2023年第17期9-9,共1页
●本轮下跌可能尚未结束,投资者对宏观环境和全球消费电子需求疲软表示担忧由于人工智能(AI)厂商的需求部分抵消了智能手机和笔记本电脑芯片销售下滑的影响,台积电第三季营收下滑幅度低于预期。据彭博新闻社计算,该公司7月至9月的营收为... ●本轮下跌可能尚未结束,投资者对宏观环境和全球消费电子需求疲软表示担忧由于人工智能(AI)厂商的需求部分抵消了智能手机和笔记本电脑芯片销售下滑的影响,台积电第三季营收下滑幅度低于预期。据彭博新闻社计算,该公司7月至9月的营收为5467亿元新台币(约合人民币1218亿元),较去年同期下降了11%。 展开更多
关键词 彭博新闻社 需求疲软 下滑幅度 笔记本电脑 消费电子 智能手机 宏观环境 市值
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