Copper and copper-based materials are widely used in power electronics,auto-mobiles,mechanical manufacturing and high-tech manufacturing fields such as aerospace,telecommunications and integrated circuits owing to the...Copper and copper-based materials are widely used in power electronics,auto-mobiles,mechanical manufacturing and high-tech manufacturing fields such as aerospace,telecommunications and integrated circuits owing to their compre-hensive advantages in mechanical,electrical conductivity and processing prop-erties.With the rapid development of technology,many emerging technical fields have introduced more challenging requirements for the electrical conductivity of copper.This article reviews the research status of high-conductivity copper-based materials and introduces three methods to improve electrical conductivity,including purification,alloying and addition of nanocarbon materials.We sum-marise the advantages,disadvantages and future development trends of methods for improving copper conductivity.The key to producing high-conductivity copper-based materials is development of low-cost,continuous and stable processes.展开更多
The intermetallic compound such as Ni_(2)Si has a brittle nature.Therefore,monolithic intermetallic compounds have not yet been prepared by mechanical downsizing.During mechanical drawing of bulk CuNi_(2)Si alloy at r...The intermetallic compound such as Ni_(2)Si has a brittle nature.Therefore,monolithic intermetallic compounds have not yet been prepared by mechanical downsizing.During mechanical drawing of bulk CuNi_(2)Si alloy at room temperature,we observed more than 400%plastic elongation of hard and brittle Ni_(2)Si intermetallic nano-fibers.The calculation based on the density functional theory reveals that the fully coherent interface induces strain on the intermetallic compound surrounded by the matrix,and lowers the intrinsic stacking fault energy below the level required to break an interatomic bond.The new interface between the Ni_(2)Si intermetallic and Cu matrix formed by the plastic deformation is as stable as the original coherent interface formed by precipitation,and the activation energy of the newly formed interface to slip is similar to that of the Cu matrix.All of these make plastic deformation of brittle Ni_(2)Si intermetallic possible by slip without failure.展开更多
基金supported by the Beijing Nova Program(No.20230484371).
文摘Copper and copper-based materials are widely used in power electronics,auto-mobiles,mechanical manufacturing and high-tech manufacturing fields such as aerospace,telecommunications and integrated circuits owing to their compre-hensive advantages in mechanical,electrical conductivity and processing prop-erties.With the rapid development of technology,many emerging technical fields have introduced more challenging requirements for the electrical conductivity of copper.This article reviews the research status of high-conductivity copper-based materials and introduces three methods to improve electrical conductivity,including purification,alloying and addition of nanocarbon materials.We sum-marise the advantages,disadvantages and future development trends of methods for improving copper conductivity.The key to producing high-conductivity copper-based materials is development of low-cost,continuous and stable processes.
基金the financial support from the National Research Foundation of Korea(Nos.2020M3D1A2098962,2018R1A5A6075959,2014M3A6B1060886)Technology Innovation Program funded By the Ministry of Trade,Industry&Energy,Korea(No.20010384)+1 种基金Fundamental Research Program of the Korean Institute of Materials Science(No.PNK7730)Cooperative program of Professional Development Consortium for Computational Materials Scientists in IMR,Tohoku University(No.20S0513)。
文摘The intermetallic compound such as Ni_(2)Si has a brittle nature.Therefore,monolithic intermetallic compounds have not yet been prepared by mechanical downsizing.During mechanical drawing of bulk CuNi_(2)Si alloy at room temperature,we observed more than 400%plastic elongation of hard and brittle Ni_(2)Si intermetallic nano-fibers.The calculation based on the density functional theory reveals that the fully coherent interface induces strain on the intermetallic compound surrounded by the matrix,and lowers the intrinsic stacking fault energy below the level required to break an interatomic bond.The new interface between the Ni_(2)Si intermetallic and Cu matrix formed by the plastic deformation is as stable as the original coherent interface formed by precipitation,and the activation energy of the newly formed interface to slip is similar to that of the Cu matrix.All of these make plastic deformation of brittle Ni_(2)Si intermetallic possible by slip without failure.
