Effect of graphite powder as a forming filler on the mechanical properties of SiCp/Al composites by pressure infiltration

（38vo1% SiCp ＋ 2vo1% A1203f）/2024 A1 composites were fabricated by pressure infiltration. Graphite powder was introduced as a forming filler in preform preparation, and the effects of the powder size on the microstructures and mechanical properties of the final com- posites were investigated. The results showed that the composite with 15 μm graphite powder as a forming filler had the maximum tensile strength of 506 MPa, maximum yield strength of 489 MPa, and maximum elongation of 1.2%, which decreased to 490 MPa, 430 MPa, and 0.4%, respectively, on increasing the graphite powder size from 15 to 60 μm. The composite with 60 μm graphite powder showed the highest elastic modulus, and the value decreased from 129 to 113 GPa on decreasing the graphite powder size from 60 to 15 μm. The differences between these properties are related to the different microstructures of the corresponding composites, which determine their failure modes.

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

Nickel-coated graphite flakes/copper（GN/Cu） composites were fabricated by spark plasma sintering with the surface of graphite flakes（GFs） being modified by Ni–P electroless plating. The effects of the phase transition of the amorphous Ni–P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity（TC） of the GN/Cu composites were systematically investigated. The introduction of Ni–P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X–Y basal plane of the GF/Cu composites with 20 vol%–30 vol% graphite flakes. However, when the graphite flake content was greater than 30 vol%, the TC of the GF/Cu composites decreased with the introduction of Ni–P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.

Effect of sintering on the relative density of Cr-coated diamond/Cu composites prepared by spark plasma sintering

Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.