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Recent Advance in Low-Dielectric-Constant Organosilicon Polymers
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作者 jiaren hou Jing Sun Qiang Fang 《Chinese Journal of Chemistry》 SCIE CAS CSCD 2023年第18期2371-2381,共11页
Comprehensive Summary,Low dielectric(low-k)organosilicon polymers have received extensive interests from industry and academia due to good electrical insulation,high temperature resistance,flame retardancy and hydroph... Comprehensive Summary,Low dielectric(low-k)organosilicon polymers have received extensive interests from industry and academia due to good electrical insulation,high temperature resistance,flame retardancy and hydrophobicity.These attractive properties enable them to be utilized as low-k materials in fabrication of electronic devices in high-frequency communication technology.This review summarizes recent progress in developing low-k organosilicon polymers,including the synthetic methods and properties of different organosilicon polymers classified according to the chemical structures.It may provide some inspiration to design new low-k organosilicon polymers for application in the. 展开更多
关键词 Organosilicon polymers Low dielectric materials Thermosetting resins Functional polymers MONOMERS RESINS
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