Thermal management is a key issue in the integrated circuit(IC)design.In this paper,the superposition strategy was experimentally validated using a modeling IC device,which was fabricated by laboratory-level microfabr...Thermal management is a key issue in the integrated circuit(IC)design.In this paper,the superposition strategy was experimentally validated using a modeling IC device,which was fabricated by laboratory-level microfabrication technique.Metal thin film resistors on the top of dielectric layer were used to analogize the multiple hot-spots in the modeling IC device.The measured temperature rise with multiple hot-spots agrees well with the predictions given by the superposition calculations.With the help of the superposition strategy,thermal management of IC device can be significantly simplified by decomposing the system into sub-systems and optimizing each part individually.The influence coefficients in the superposition strategy extracted from the experimental measurement offer the IC designers a useful engineering tool to facility the thermal optimization and evaluate the thermal performance of IC devices.展开更多
Through-silicon via(TSV)is a key enabling technology for the emerging 3-dimension(3 D)integrated circuits(ICs).However,the crosstalk between the neighboring TSVs is one of the important sources of the soft faults.To s...Through-silicon via(TSV)is a key enabling technology for the emerging 3-dimension(3 D)integrated circuits(ICs).However,the crosstalk between the neighboring TSVs is one of the important sources of the soft faults.To suppress the crosstalk,the Fibonacci-numeral-system-based crosstalk avoidance code(FNS-CAC)is an effective scheme.Meanwhile,the self-repair schemes are often used to deal with the hard faults,but the repaired results may change the mapping between signals to TSVs,thus may reduce the crosstalk suppression ability of FNS-CAC.A TSV self-repair technique with an improved FNS-CAC codec is proposed in this work.The codec is designed based on the improved Fibonacci numeral system(FNS)adders,which are adaptive to the health states of TSVs.The proposed self-repair technique is able to suppress the crosstalk and repair the faulty TSVs simultaneously.The simulation and analysis results show that the proposed scheme keeps the crosstalk suppression ability of the original FNS-CAC,and it has higher reparability than the local self-repair schemes,such as the signal-switching-based and the signal-shifting-based counterparts.展开更多
基金supported by the National Science and Technology Major Project of China(Grant No.2009ZX02038-02)the Doctoral Fund of Ministry of Education of China(Grant No.20130001110006)
文摘Thermal management is a key issue in the integrated circuit(IC)design.In this paper,the superposition strategy was experimentally validated using a modeling IC device,which was fabricated by laboratory-level microfabrication technique.Metal thin film resistors on the top of dielectric layer were used to analogize the multiple hot-spots in the modeling IC device.The measured temperature rise with multiple hot-spots agrees well with the predictions given by the superposition calculations.With the help of the superposition strategy,thermal management of IC device can be significantly simplified by decomposing the system into sub-systems and optimizing each part individually.The influence coefficients in the superposition strategy extracted from the experimental measurement offer the IC designers a useful engineering tool to facility the thermal optimization and evaluate the thermal performance of IC devices.
基金supported in part by the Key-Area Research and Development Program of Guangdong Province(2019B010155002)the National Key Research and Development Project(2018YFB2202600)the Research and Development Project of Shenzhen Government(ZDSYS201802061805105).
文摘Through-silicon via(TSV)is a key enabling technology for the emerging 3-dimension(3 D)integrated circuits(ICs).However,the crosstalk between the neighboring TSVs is one of the important sources of the soft faults.To suppress the crosstalk,the Fibonacci-numeral-system-based crosstalk avoidance code(FNS-CAC)is an effective scheme.Meanwhile,the self-repair schemes are often used to deal with the hard faults,but the repaired results may change the mapping between signals to TSVs,thus may reduce the crosstalk suppression ability of FNS-CAC.A TSV self-repair technique with an improved FNS-CAC codec is proposed in this work.The codec is designed based on the improved Fibonacci numeral system(FNS)adders,which are adaptive to the health states of TSVs.The proposed self-repair technique is able to suppress the crosstalk and repair the faulty TSVs simultaneously.The simulation and analysis results show that the proposed scheme keeps the crosstalk suppression ability of the original FNS-CAC,and it has higher reparability than the local self-repair schemes,such as the signal-switching-based and the signal-shifting-based counterparts.
