To reinforce compatibility with the thermophysical and mechanical properties of SiC/Al composites for electronic packaging to improve the stability and reduce fatigue failure of electronic integrated devices,a novel 3...To reinforce compatibility with the thermophysical and mechanical properties of SiC/Al composites for electronic packaging to improve the stability and reduce fatigue failure of electronic integrated devices,a novel 3D SiC reinforced framework with interpenetrated plate-like a-SiC grains was synthesized.A small amount of doped a-SiC was seeded to induce the transformation of b-SiC to plate-like a-SiC at 2,300℃,forming a high-purity a-SiC strongly bonded framework.Vacuum/gas pressure infiltration of Al alloy was subsequently used to manufacture the 3D interpenetrated network structure SiC/Al(SiC3D/Al)composite.Characterization results showed that 15%(in mass)seeds provided the composite with the optimal comprehensive performance,including a low coefficient of thermal expansion(CTE)of 5.54×10^(-6)K^(-1),a high thermal conductivity(l)of 239.08 W·m^(-1)·K^(-1),the highest flexural strength of 326.84 MPa,and a low thermal deformation parameter(TDP)of 0.023.High-purity plate-like grains enhanced the purity of the framework promoting a significant improvement in l.As the seed content increased to 20%(in mass),both CTE and l reached optimal values of 5.22×10^(-6)K^(-1)and 243.14 W·m^(-1)·K^(-1),but the mechanical properties declined by 10.30%.The synergistic effect of the well-bonded interface and the high-purity 3D SiC framework balanced excellent mechanical properties and multiple thermal functions.展开更多
基金support from the National Natural Science Foundation of China(52202060)the Fundamental Research Funds for the Central Universities of Hunan University(531118010545)the Natural Science Foundation of Hunan Province(2021JJ40174,2021JJ40088,2022JJ30133),and Chinese Academy of Sciences Technical Institute of Physics and Chemistry provided b-SiC powder.
文摘To reinforce compatibility with the thermophysical and mechanical properties of SiC/Al composites for electronic packaging to improve the stability and reduce fatigue failure of electronic integrated devices,a novel 3D SiC reinforced framework with interpenetrated plate-like a-SiC grains was synthesized.A small amount of doped a-SiC was seeded to induce the transformation of b-SiC to plate-like a-SiC at 2,300℃,forming a high-purity a-SiC strongly bonded framework.Vacuum/gas pressure infiltration of Al alloy was subsequently used to manufacture the 3D interpenetrated network structure SiC/Al(SiC3D/Al)composite.Characterization results showed that 15%(in mass)seeds provided the composite with the optimal comprehensive performance,including a low coefficient of thermal expansion(CTE)of 5.54×10^(-6)K^(-1),a high thermal conductivity(l)of 239.08 W·m^(-1)·K^(-1),the highest flexural strength of 326.84 MPa,and a low thermal deformation parameter(TDP)of 0.023.High-purity plate-like grains enhanced the purity of the framework promoting a significant improvement in l.As the seed content increased to 20%(in mass),both CTE and l reached optimal values of 5.22×10^(-6)K^(-1)and 243.14 W·m^(-1)·K^(-1),but the mechanical properties declined by 10.30%.The synergistic effect of the well-bonded interface and the high-purity 3D SiC framework balanced excellent mechanical properties and multiple thermal functions.
