Microstructure evolution from silicon core to surface in electronic-grade polycrystalline silicon

Large-size electronic-grade polycrystalline silicon is an important material in the semiconductor industry with broad application prospects.However,electronic-grade polycrystalline silicon has extremely high requirements for production technology and currently faces challenges such as carbon impurity breakdown,microstructure and composition nonuniformity and a lack of methods for preparing large-size mirror-like polycrystalline silicon samples.This paper innovatively uses physical methods such as wire cutting,mechanical grinding and ion thinning polishing to prepare large-size polycrystalline silicon samples that are clean,smooth,free from wear and have clear crystal defects.The material was characterized at both macroscopic and microscopic levels using metallographic microscopy,scanning electron microscopy(SEM)with backscattered electron diffraction(EBSD)techniques and scanning transmission electron microscopy(STEM).The crystal structure changes from single crystal silicon core to the surface of the bulk in the large-size polycrystalline silicon samples were revealed,providing a technical basis for optimizing and improving production processes.

Microstructure of electronic-grade polycrystalline silicon core-matrix interface

This paper focuses on the problems encountered in the production process of electronic-grade polycrystalline silicon.It points out that the characterization of electronic-grade polycrystalline silicon is mainly concentrated at the macroscopic scale,with relatively less research at the mesoscopic and microscopic scales.Therefore,we utilize the method of physical polishing to obtain polysilicon characterization samples and then the paper utilizes metallographic microscopy,scanning electron microscopy-electron backscatter diffraction technology,and aberration-corrected transmission electron microscopy technology to observe and characterize the interface region between silicon core and matrix in the deposition process of electronic-grade polycrystalline silicon,providing a full-scale characterization of the interface morphology,grain structure,and orientation distribution from macro to micro.Finally,the paper illustrates the current uncertainties regarding polycrystalline silicon.