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Simulation of X-ray Diffraction Line Broadening Caused by Stress Gradients and Determination of Stress Distribution by Fourier Analysis
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作者 Vladimir Ivanovltch Monin joaquim teixera de assis Susana Marrero Iglesias 《Journal of Chemistry and Chemical Engineering》 2012年第9期838-842,共5页
Different physical, mechanical and chemical processes, such as: ion implantation, oxidation, nitridation and others create on the surface of materials residual stress state, characterized by high level and strong gra... Different physical, mechanical and chemical processes, such as: ion implantation, oxidation, nitridation and others create on the surface of materials residual stress state, characterized by high level and strong gradient. X-ray diffraction method widely used for stress measurements has some difficulties in interpretation of experimental data, when the depth of X-ray penetration is compared with thickness of surface layer where inhomogeneous stress distribution is localized. Early it has been shown by authors that diffraction line broadening occurs when analyzed surface is characterized by strong gradient. The interest to study the diffraction line broadening is connected to the possibility of obtaining information about parameters of surface stress distribution. In the present paper the convolution and deconvolution concepts of Fourier analysis were applied to study X ray diffraction line broadening caused by surface stress gradients. Developed methodology allows determining of stress distribution in superficial layers of materials. 展开更多
关键词 Stress gradient X-ray diffraction computer simulation Fourier analysis.
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