The effects of various contaminants in the electrolytic refinement of indium were investigated using a glow discharge mass spectrometer(GDMS).The effects of several factors such as the indium ion(In3+)concentration,th...The effects of various contaminants in the electrolytic refinement of indium were investigated using a glow discharge mass spectrometer(GDMS).The effects of several factors such as the indium ion(In3+)concentration,the sodium chloride(NaCl)concentration,the current density,the gelatin concentration,the pH,and the electrode distance,were examined.Significant variations in impurity levels concerning gelatin concentration were observed.Both the gelatin and In3+concentration were moderately positively correlated with the Pb content.The Sb concentration was associated positively with the NaCl concentration,while the Ti concentration had an adverse correlation with the NaCl concentration.The Bi element content was positively linked to the electrode distance.As the current density increased,Cu,Pb,and Bi impurities initially rose and then eventually declined.Notably,a critical current density of 45 A·m^(-2) was identified in this behavior.展开更多
The effects of Mn addition(0.005,0.01,0.03,0.05,and 0.07 wt.%)on microstructure,shear mechanical behavior,and interfacial thermal stabilities of SAC305 joints were investigated under isothermal aging temperatures of 1...The effects of Mn addition(0.005,0.01,0.03,0.05,and 0.07 wt.%)on microstructure,shear mechanical behavior,and interfacial thermal stabilities of SAC305 joints were investigated under isothermal aging temperatures of 170 C with different aging time(0,250,500,and 750 h).It is found that Mn addition can increase fracture energy of joints without decreasing the shear strength.And the microstructures have transformed from the eutectic net-like structure in SAC305 solder joints into the structures based onβ-Sn matrix with intermetallic compounds(IMCs)distributed.By doping 0.07 wt.%Mn,the Cu_(6)Sn_(5) growth along the SAC305/Cu interface during thermal aging can be inhibited to some extent.During isothermal aging at 170°C,the maximum shear force of solder joint decreases continuously with aging time increasing,while the fracture energy rises first and then decreases,reaching the maximum at 500 h compared by that with the microstructure homogenization.Cu_(3)Sn growth between Cu_(3)Sn_(5)/Cu interface has been retarded most at the aging time of 250 h with 0.07 wt.%Mn-doped joints.With the aging time prolonging,the inhibition effect of Mn on CusSn IMC layer becomes worse.The strengthening effect of Mn can be explained by precipitation strengthening,and its mechanical behavior can be predicted by particle strengthening model proposed by Orowan.展开更多
基金supported by the National Natural Science Foundation of China(52074180)the Science and Technology Major Project of Yunnan Province(202302AB080020)+2 种基金the Independent Research Project of State Key Laboratory of Advanced Special Steel,Shanghai Key Laboratory of Advanced Ferrometallurgy,Shanghai University(SKLASS 2023-Z07)the Science and Technology Commission of Shanghai Municipality(19DZ2270200)the Program for Professor of Special Appointment(Eastern Scholar)at SIHL,Shanghai Sailing Program(19YF1416500).
文摘The effects of various contaminants in the electrolytic refinement of indium were investigated using a glow discharge mass spectrometer(GDMS).The effects of several factors such as the indium ion(In3+)concentration,the sodium chloride(NaCl)concentration,the current density,the gelatin concentration,the pH,and the electrode distance,were examined.Significant variations in impurity levels concerning gelatin concentration were observed.Both the gelatin and In3+concentration were moderately positively correlated with the Pb content.The Sb concentration was associated positively with the NaCl concentration,while the Ti concentration had an adverse correlation with the NaCl concentration.The Bi element content was positively linked to the electrode distance.As the current density increased,Cu,Pb,and Bi impurities initially rose and then eventually declined.Notably,a critical current density of 45 A·m^(-2) was identified in this behavior.
基金support received from Yunnan Fundamental Research Projects(Grant No.202101BC070001-007)the Jiangsu Province Industry-University-Research Cooperation Project(No.BY2022832)the National Natural Science Foundation of China(No.52275339).
文摘The effects of Mn addition(0.005,0.01,0.03,0.05,and 0.07 wt.%)on microstructure,shear mechanical behavior,and interfacial thermal stabilities of SAC305 joints were investigated under isothermal aging temperatures of 170 C with different aging time(0,250,500,and 750 h).It is found that Mn addition can increase fracture energy of joints without decreasing the shear strength.And the microstructures have transformed from the eutectic net-like structure in SAC305 solder joints into the structures based onβ-Sn matrix with intermetallic compounds(IMCs)distributed.By doping 0.07 wt.%Mn,the Cu_(6)Sn_(5) growth along the SAC305/Cu interface during thermal aging can be inhibited to some extent.During isothermal aging at 170°C,the maximum shear force of solder joint decreases continuously with aging time increasing,while the fracture energy rises first and then decreases,reaching the maximum at 500 h compared by that with the microstructure homogenization.Cu_(3)Sn growth between Cu_(3)Sn_(5)/Cu interface has been retarded most at the aging time of 250 h with 0.07 wt.%Mn-doped joints.With the aging time prolonging,the inhibition effect of Mn on CusSn IMC layer becomes worse.The strengthening effect of Mn can be explained by precipitation strengthening,and its mechanical behavior can be predicted by particle strengthening model proposed by Orowan.
