Optimization experiment on eccentric lapping of cylindrical rollers

Cylindrical rollers are important elements of bearings,and their machining accuracy and consistency affect the bearing quality.Using a GCr15 cylindrical roller ofФ11×12 as the processing object in this study,the effects of loading pressure,abrasive concentration,and speed combination on cylindrical roller machining precision were investigated using the orthogonal experimental design method on a double-side eccentric pendulum lapping and polishing machine.The machining parameters of the lapping stage were optimized,and the lapping optimal process parameters were determined by S/N response analysis and analysis of variance(ANOVA).The results show that when the experiment was optimized using loading pressure of 10 N/roller,abrasive concentrationof 20.0 wt%,and rotational speed combination,the material removal rate(MRR)of cylindrical roller reached 0.0896μm/min;the average roughness of the batch decreased from 0.056μm to 0.027μm,51.8%lower than the original batch average roughness,and the deviation decreased from the initial 0.022μm to 0.014μm;the batch average roundness error decreased from 0.47μm to 0.28μm,40.4%lower than the original batch average roundness error,and the deviation decreased from the initial 0.19μm to 0.038μm;and the batch average diameter variation decreased from 4.5μm to about 3.6μm,20%lower than the original batch average diameter variation.The double-side eccentric lapping of cylinder rollers does not only lead to improvement in the surface quality and shape accuracy of rollers,but also improvement in the batch consistency.

Cutting edge preparation of microdrills by shear thickening polishing for improved hole quality in electronic PCBs

Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the industry.The finishing of the cutting edge of a microdrill is crucial to drill performance in machining fine-quality holes with a prolonged tool life.The miniature size involving submicron scale geometric dimensions,a complex flute shape,and low fracture toughness makes the cutting edge of microdrills susceptible to breakage and has been the primary limiting factor in edge preparation for microdrills.In this study,a newly developed cutting edge preparation method for microdrills was tested experimentally on electronic printed circuit boards.The proposed method,namely,shear thickening polishing,limited the cutting edge burrs and chipping on the cutting edge,and this in turn transformed the cutting edge’s radius from being sharp to smooth.Moreover,the edge–edge radius could be regulated by adjusting the processing time.PCB drilling experiments were conducted to investigate the influence of different cutting edge radii on wear,hole position accuracy,nail head value,and hole wall roughness.The proposed approach showed 20%enhancement in hole position accuracy,33%reduction in the nail head value,and 19%reduction in hole wall roughness compared with the original microdrill.However,a threshold is needed;without it,excessive shear thickening polishing will result in a blunt edge,which may accelerate the wear of the microdrill.Wear was identified as the primary factor that reduced hole quality.The study indicates that in printed circuit board machining,microdrills should effectively eliminate grinding defects and maintain the sharpness of the cutting edge as much as possible to obtain excellent drilling quality.Overall,shear thickening polishing is a promising method for cutting edge preparation of microdrills.Further research and optimization can lead to additional improvements in microdrill performance and contribute to the continued advancement of printed circuit board manufacturing.

Edge preparation methods for cutting tools:a review

Edge preparation can remove cutting edge defects,such as burrs,chippings,and grinding marks,generated in the grinding process and improve the cutting performance and service life of tools.Various edge preparation methods have been proposed for different tool matrix materials,geometries,and application requirements.This study presents a scientific and systematic review of the development of tool edge preparation technology and provides ideas for its future development.First,typical edge characterization methods,which associate the microgeometric characteristics of the cutting edge with cutting performance,are briefly introduced.Then,edge preparation methods for cutting tools,in which materials at the cutting edge area are removed to decrease defects and obtain a suitable microgeometry of the cutting edge for machining,are discussed.New edge preparation methods are explored on the basis of existing processing technologies,and the principles,advantages,and limitations of these methods are systematically summarized and analyzed.Edge preparation methods are classified into two categories:mechanical processing methods and nontraditional processing methods.These methods are compared from the aspects of edge consistency,surface quality,efficiency,processing difficulty,machining cost,and general availability.In this manner,a more intuitive understanding of the characteristics can be gained.Finally,the future development direction of tool edge preparation technology is prospected.

Review on the progress of ultra-precision machining technologies

Ultra-precision machining technologies are the essential methods, to obtain the highest form accuracy and surface quality. As more research findings are published, such technologies now involve complicated systems engineering and been widely used in the production of components in various aerospace, national defense, optics, mechanics, electronics, and other high-tech applications. The conception, applications and history of ultra-precision machining are introduced in this article, and the develop- ments of ultra-precision machining technologies, espe- cially ultra-precision grinding, ultra-precision cutting and polishing are also reviewed. The current state and problems of this field in China are analyzed. Finally, the development trends of this field and the coping strategies employed in China to keep up with the trends are discussed.

Processing of high-precision ceramic balls with a spiral V-groove plate

As the demand for high-performance bearings gradually increases, ceramic balls with excellent proper- ties, such as high accuracy, high reliability, and high chemical durability used, are extensively used for high- performance bearings. In this study, a spiral V-groove plate method is employed in processing high-precision ceramic balls. After the kinematic analysis of the ball-spin angle and enveloped lapping trajectories, an experimental rig is constructed and experiments are conducted to confirm the feasibility of this method. Kinematic analysis results indicate that the method not only allows for the control of the ball-spin angle but also uniformly distributes the enveloped lapping trajectories over the entire ball surface. Experimental results demonstrate that the novel spiral V- groove plate method performs better than the conventional concentric V-groove plate method in terms of roundness, surface roughness, diameter difference, and diameter decrease rate. Ceramic balls with a G3-1evel accuracy are achieved, and their typical roundness, minimum surface roughness, and diameter difference are 0.05, 0.0045, and 0.105 μm, respectively. These findings confirm that the proposed method can be applied to high-accuracy and high-consistency ceramic ball processing.

Degradation of Azo dye direct black BN based on adsorption and microwave-induced catalytic reaction

The novel microwave catalyst MgFe204-SiC was synthesized via sol-gel method, to remove azo dye Direct Black BN （DB BN） through adsorption and microwave-induced catalytic reaction. Microwave- induced catalytic degradation of DB BN, including adsorption behavior and its influencing Factors of DB BN on MgFc204-SiC were investigated. According to the obtained results, il indicated thai the pseudo-second-order kinetics model was suitable fbr the adsorption of DB BN onto MgFc204-SiC. Besides, the consequence of adsorption isotherm depicted that the adsorption of DB BN was in accordance with the Langmuir isotherm, which verified that the singer layer adsorption of MgF%O4- SiC was dominant than the multi-layer one. The excellent adsorption capacities of MgFe204-SiC were kept in the range of initial pH from 3 to 7. In addition, it could be concluded that the degradation rate of DB BN decreased over ten percent after the adsorption equilibrium had been attained, and thc results from the result of comparative experiments manitbsted that the adsorption process was not conducive to the process of microwave-induced catalytic degradation. The degradation intermediates and products of DB BN were identified and determined by GC-MS and LC-MS. Furthermore, combined with the catalytic mechanism of MgFe204-SiC, the proposed degradation pathways of DB BN were the involution of microwave-induced OH and holes in this catalytic system the breakage of azo bond, hydroxyl substitution, hydroxyl addition, nitration reaction, dcamination reaction, dcsorbate reaction, dehydroxy group and ring-opening reaction.