Hybrid dielectric barrier discharges are investigated for plasma generated on the surface of a dielectric layer, where two conducting electrodes of high voltage and ground are formulated on the upper and bottom surfac...Hybrid dielectric barrier discharges are investigated for plasma generated on the surface of a dielectric layer, where two conducting electrodes of high voltage and ground are formulated on the upper and bottom surfaces. Using a flexible thin polyimide-film of a thickness ranging from 25 to 125 μm, a plasma is generated with a voltage of about 1 kV and a frequency of 40 kHz.However, the surface of the dielectric layer was etched through a chemical reaction involving plasma oxygen radical species, and thus the polyimide films failed readily, resulting in dielectric breakdown within short operating time ranging from a few minutes to several tens of minutes,based on the film thicknesses of 25 μm and 125 μm, respectively. These plasma erosions were prevented by coating the polyimide surface with a 25 μm thick silicone paste. The siliconecoated film surface was then reinforced remarkably against plasma erosion as the organic polymer was vulnerable to chemical reaction of the plasma species, while the inorganic silicone exhibited a high chemical resistance against plasma erosion.展开更多
基金supported in part by the Korean Institute of Energy Technology Evaluation and Planning (KETEP)the Ministry of Trade, Industry & Energy (MOTIE) of the Republic of Korea (No. 20173030014460)partly by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (NRF-2018R1A2B6008642)
文摘Hybrid dielectric barrier discharges are investigated for plasma generated on the surface of a dielectric layer, where two conducting electrodes of high voltage and ground are formulated on the upper and bottom surfaces. Using a flexible thin polyimide-film of a thickness ranging from 25 to 125 μm, a plasma is generated with a voltage of about 1 kV and a frequency of 40 kHz.However, the surface of the dielectric layer was etched through a chemical reaction involving plasma oxygen radical species, and thus the polyimide films failed readily, resulting in dielectric breakdown within short operating time ranging from a few minutes to several tens of minutes,based on the film thicknesses of 25 μm and 125 μm, respectively. These plasma erosions were prevented by coating the polyimide surface with a 25 μm thick silicone paste. The siliconecoated film surface was then reinforced remarkably against plasma erosion as the organic polymer was vulnerable to chemical reaction of the plasma species, while the inorganic silicone exhibited a high chemical resistance against plasma erosion.
