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5.9 GHz Vehicular Channels Comparisons Between Two Traffic Status for Dense Urban Area
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作者 fang li wei chen +6 位作者 yishui shui lida xu junyi yu changzhen li kun yang fuxing chang yi liu 《China Communications》 SCIE CSCD 2018年第4期58-71,共14页
This study focused on differences in vehicle-to-vehicle radio channel characteristics in the same region but different traffic density and speeds at 5.9 GHz(congestion and non-congestion). The continuous measurement c... This study focused on differences in vehicle-to-vehicle radio channel characteristics in the same region but different traffic density and speeds at 5.9 GHz(congestion and non-congestion). The continuous measurement campaign was conducted on a city expressway through the complex dense urban area in Wuhan, China. Small-scale channel characteristics including power delay profile, amplitude fading distribution, K-factor, delay spread and Doppler shift were obtained, respectively. Specifically, the cumulative distribution function of root mean square delay spreads and root mean square Doppler spreads in the non-congested scenario and congested scenario were all fitted well with Lognormal distribution. We also found out that different intensity of traffic and speed of vehicles have little effect on root mean square delay spreads, but have a big impact on root mean square Doppler spreads and level crossing rate. According to estimation outcomes, the V2 V channel characteristics for urban areas in Chinese big city were different from the previous measured results under similar scenarios in Europe. Delay spread and level crossing rate in this study can provide significant references to design the wireless communication system for vehicle-to-vehicle channel. 展开更多
关键词 城市高速公路 隧道设计 交通密度 GHZ 稠密 车辆 无线通讯系统 连续测量
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VSMC specific long non-coding RNA, RASAL2-AS1 is upregulated in aortae of SHR, and regulates VSMC plasticity by enhancing transcription of AGTR1a
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作者 junyi yu yukai Liu +5 位作者 Gengze Wu yue Cai Zaicheng Xu Yang Yang Hao Luo Chunyu Zeng 《中国循环杂志》 CSCD 北大核心 2016年第z1期-,共1页
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面向FC-BGA的增层胶膜封装基板镀铜工艺
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作者 李鹏 于均益 +4 位作者 罗遂斌 赖志强 肖彬 于淑会 孙蓉 《中国科学:化学》 CAS CSCD 北大核心 2023年第10期1866-1879,共14页
近年来,基于增层胶膜材料,采用半加成法工艺生产制造窄线宽/线距电子线路的倒装芯片球栅阵列(FCBGA)封装基板的相关技术发展迅速.增层胶膜材料微观结构及其物理、化学性质、镀铜工艺参数和化学药水等多个因素共同决定线路精细度和结合力... 近年来,基于增层胶膜材料,采用半加成法工艺生产制造窄线宽/线距电子线路的倒装芯片球栅阵列(FCBGA)封装基板的相关技术发展迅速.增层胶膜材料微观结构及其物理、化学性质、镀铜工艺参数和化学药水等多个因素共同决定线路精细度和结合力,并最终影响封装基板的品质和可靠性,其内在关联性值得关注和深入研究.本文基于FC-BGA增层胶膜封装基板的导电互连制造技术,重点探讨半加成法工艺所用化学药水的成分及作用,并结合镀铜的性能评价,提出未来进一步提高封装基板线路品质的发展方向. 展开更多
关键词 封装基板 增层胶膜 倒装芯片球栅阵列 镀铜 半加成法 精细线路
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High-fidelity and clean nanotransfer lithography using structure-embedded and electrostatic-adhesive carriers 被引量:1
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作者 Zhuofei Gan Jingxuan Cai +11 位作者 Zhao Sun Liyang Chen Chuying Sun junyi yu Zeyu Liang Siyi Min Fei Han yu Liu Xing Cheng Shuhui yu Dehu Cui Wen-Di Li 《Microsystems & Nanoengineering》 SCIE CSCD 2023年第1期253-261,共9页
Metallic nanostructures are becoming increasingly important for both fundamental research and practical devices.Many emerging applications employing metallic nanostructures often involve unconventional substrates that... Metallic nanostructures are becoming increasingly important for both fundamental research and practical devices.Many emerging applications employing metallic nanostructures often involve unconventional substrates that are flexible or nonplanar,making direct lithographic fabrication very difficult.An alternative approach is to transfer prefabricated structures from a conventional substrate;however,it is still challenging to maintain high fidelity and a high yield in the transfer process.In this paper,we propose a high-fidelity,clean nanotransfer lithography method that addresses the above challenges by employing a polyvinyl acetate(PVA)film as the transferring carrier and promoting electrostatic adhesion through triboelectric charging.The PVA film embeds the transferred metallic nanostructures and maintains their spacing with a remarkably low variation of<1%.When separating the PVA film from the donor substrate,electrostatic charges are generated due to triboelectric charging and facilitate adhesion to the receiver substrate,resulting in a high large-area transfer yield of up to 99.93%.We successfully transferred the metallic structures of a variety of materials(Au,Cu,Pd,etc.)with different geometries with a<50-nm spacing,high aspect ratio(>2),and complex 3D structures.Moreover,the thin and flexible carrier film enables transfer on highly curved surfaces,such as a single-mode optical fiber with a curvature radius of 62.5μm.With this strategy,we demonstrate the transfer of metallic nanostructures for a compact spectrometer with Cu nanogratings transferred on a convex lens and for surface-enhanced Raman spectroscopy(SERS)characterization on graphene with reliable responsiveness. 展开更多
关键词 TRANSFER TRANSFERRED film
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