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半固态加工Ti−Cu合金的显微组织和力学行为
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作者 kaio niitsu campo Caio Chaussêde FREITAS +3 位作者 Éder Sócrates Najar LOPES Suk-Chun MOON Rian DIPPENAAR Rubens CARAM 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2022年第11期3578-3586,共9页
研究触变成形Ti−Cu合金的力学性能。Ti−Cu(25%,27%,29%Cu,质量分数)锭的制备流程为:先进行电弧熔炼,再在950℃均匀化处理24 h,然后在900℃热锻,最后在1035℃热处理300 s后以8 mm/s的速度触变成形。结果显示,触变成形合金表现出良好的力... 研究触变成形Ti−Cu合金的力学性能。Ti−Cu(25%,27%,29%Cu,质量分数)锭的制备流程为:先进行电弧熔炼,再在950℃均匀化处理24 h,然后在900℃热锻,最后在1035℃热处理300 s后以8 mm/s的速度触变成形。结果显示,触变成形合金表现出良好的力学强度,但其在拉伸载荷下的塑性一般,在压缩载荷下的塑性尚可。随着Cu含量的增加,包晶Ti_(2)Cu相(转变液相区)的体积分数增加,与α+Ti_(2)Cu相区(转变固相区)相比,其力学强度和塑性更低,导致合金的力学强度和塑性降低。这些结果表明,Ti−Cu合金的力学性能和半固态加工性之间的平衡主要取决于Cu含量。 展开更多
关键词 半固态加工 触变成形 Ti−Cu合金 显微组织 力学性能
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Melting behavior and globular microstructure formation in semi-solid CoCrCuxFeNi high-entropy alloys 被引量:1
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作者 kaio niitsu campo Caio Chaussêde Freitas +1 位作者 Leonardo Fanton Rubens Caram 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2020年第17期207-217,共11页
High-entropy alloys can be compelling raw materials for semi-solid applications.In the present study,the influence of the Cu content on the melting behavior and semi-solid microstructure of CoCrCuxFeNi(x=0,1,2,3)alloy... High-entropy alloys can be compelling raw materials for semi-solid applications.In the present study,the influence of the Cu content on the melting behavior and semi-solid microstructure of CoCrCuxFeNi(x=0,1,2,3)alloys was investigated.Arc-melted samples were cross-rolled at room temperature and then isothermally treated at 1175℃in the semi-solid state for 300 s.Microstructural characterization showed that the alloys containing Cu were formed by two fcc phases.Notably,the increase in Cu content also led to an increase in the volumetric fraction of the Cu-rich phase.During solidification,this phase,which is the last to form,nucleates and epitaxially grows on the Cu-lean phase.All the studied CoCrCuFeNi alloys exhibited the same melting behavior.The Cu-rich phase melts at approximately 1120℃,whereas the Culean phase melts at approximately 1350℃,providing a suitable processing temperature range of more than 200℃.The semi-solid microstructures were considerably refined and globular regardless of the alloy composition,being suitable for semi-solid processing.Furthermore,each fcc phase exhibited roughly the same composition under the different processing conditions.The Cu content in the Cu-lean phase was approximately 10 at.%,while Co,Cr,Fe,and Ni were in an approximately equiatomic ratio.Meanwhile,the Cu content was between 80 at.%and 86 at.%in the Cu-rich phase.The isothermal treatment of the CoCrCu3FeNi alloy at a higher temperature(1300℃)only caused the globules to coarsen.In conclusion,this work showed that these alloys can be potential candidates for semi-solid processing. 展开更多
关键词 Semi-solid processing THIXOFORMING High-entropy alloys MICROSTRUCTURE
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