Interfacial microstructure and mechanical behavior of Mg/Cu bimetal composites fabricated by compound casting process

Mg/Cu bimetal composites were prepared by compound casting method, and the microstructure evolution, phase constitution and bonding strength at the interface were investigated.It is found that a good metallurgical bonding can be achieved at the interface of Mg and Cu,which consists of two sub-layers,i.e.,layer I with 30μm on the copper side composed of Mg2Cu matrix phase, on which a small amount of dendritic MgCu2 phase was randomly distributed;layerⅡ with 140μm on the magnesium side made up of the lamellar nano-eutectic network Mg2Cu+(Mg) and a small amount of detached Mg2Cu phase. The average interfacial shear strength of the bimetal composite is measured to be 13 MPa.This study provides a new fabrication process for the application of Mg/Cu bimetal composites as the hydrogen storage materials.

Comparisons of interface microstructure and mechanical behavior between Ti/Al and Ti-6Al-4V/Al bimetallic composites

The microstructure, interface thickness, element distribution and interfacial mechanical behavior of Ti-6Al-4V/Al couples prepared by an insert moulding method were investigated in depth in this paper. Moreover, Ti/Al bonding was also given as a comparison for understanding the interface bonding mechanism. It is shown that there is much thinner compact sub-layer for the interface of the Ti-6Al-4V/Al joint, whose morphology is obviously different from that of the Ti/Al joint. The Ti-6Al-4V/Al interface has been proven to contain a slight content of vanadium. Moreover, both the shear strength and the interface reaction rate of Ti-6Al-4V/Al compound materials are lower than those of the Ti/Al ones.

Interfacial microstructure and mechanical properties of Ti-6Al-4V/Al7050 joints fabricated using the insert molding method

Ti-6Al-4V/Al7050 joints were fabricated by a method of insert molding and corresponding interfacial microstructure and mechanical properties were investigated. The interfacial thickness was sensitive to holding temperature during the first stage, and a good metallurgical bonding interface with a thickness of about 90 μm can be obtained at 750°C. X-ray diffraction, transmission electron microscopy, and thermodynamic analyses showed that the interface mainly contained intermetallic compound TiAl_3 and Al matrix. The joints featured good mechanical properties, i.e., shear strength of 154 MPa, tensile strength of 215 MPa, and compressive strength of 283 MPa, which are superior to those of joints fabricated by other methods. Coherent boundaries between Al/TiAl_3 and TiAl_3/Ti were confirmed to contribute to outstanding interfacial mechanical properties and also explained constant fracture occurrence in the Al matrix. Follow-up studies should focus on improving mechanical properties of the Al matrix by deformation and heat treatment.