Silicon carbide(SiC),as a third-generation semiconductor material,possesses exceptional material properties that significantly enhance the performance of power devices.The SiC lateral double-diffused metal–oxide–sem...Silicon carbide(SiC),as a third-generation semiconductor material,possesses exceptional material properties that significantly enhance the performance of power devices.The SiC lateral double-diffused metal–oxide–semiconductor(LDMOS)power devices have undergone continuous optimization,resulting in an increase in breakdown voltage(BV)and ultra-low specific on-resistance(Ron,sp).This paper has summarized the structural optimizations and experimental progress of SiC LDMOS power devices,including the trench-gate technology,reduced surface field(RESURF)technology,doping technology,junction termination techniques and so on.The paper is aimed at enhancing the understanding of the operational mechanisms and providing guidelines for the further development of SiC LDMOS power devices.展开更多
A novel SiC double-trench metal-oxide-semiconductor field effect transistor(MOSFET) with integrated MOS-channel diode is proposed and investigated by Sentaurus TCAD simulation. The new SiC MOSFET has a trench gate and...A novel SiC double-trench metal-oxide-semiconductor field effect transistor(MOSFET) with integrated MOS-channel diode is proposed and investigated by Sentaurus TCAD simulation. The new SiC MOSFET has a trench gate and a stepped-trench source, and features an integrated MOS-channel diode on the top sidewall of the source trench(MT MOS). In the reverse conduction state, the MOS-channel diode turns on firstly to prevent the internal parasitic body diode being activated, and thus reduces the turn-on voltage VFand suppresses the bipolar degradation phenomena. The VFof1.70 V(@Ids=-100 A/cm^(2)) for the SiC MT MOS is 38.2% lower than that of SiC double-trench MOSFET(DT MOS).Meanwhile, the reverse recovery charge Qrrof the MT MOS is 58.7% lower than that of the DT MOS at Iload= 700 A/cm^(2),and thus the reverse recovery loss is reduced. Furthermore, owing to the modulation effect induced by the double trenches,the MT MOS preserves the same superior forward conduction and blocking performance as those of DT MOS, with 22.9% and 18.2% improvement on breakdown voltage and RON,spcompared to the trench gate MOSFET with planar integrated SBD(ST MOS).展开更多
基金supported by the National Natural Science Foundation of China(Grant No.62074080)the Natural Science Foundation of Jiangsu Province(Grant Nos.BK20211104 and BK20201206)the Jiangsu Provincial Key Research and Development Program(Grant No.BE2022126).
文摘Silicon carbide(SiC),as a third-generation semiconductor material,possesses exceptional material properties that significantly enhance the performance of power devices.The SiC lateral double-diffused metal–oxide–semiconductor(LDMOS)power devices have undergone continuous optimization,resulting in an increase in breakdown voltage(BV)and ultra-low specific on-resistance(Ron,sp).This paper has summarized the structural optimizations and experimental progress of SiC LDMOS power devices,including the trench-gate technology,reduced surface field(RESURF)technology,doping technology,junction termination techniques and so on.The paper is aimed at enhancing the understanding of the operational mechanisms and providing guidelines for the further development of SiC LDMOS power devices.
基金the support by the Science & Technology Program (High voltage and high power SiC material, devices and the application demonstration in power electronic transformers) of the State Grid Corporation of China Co. Ltd.supported by the National Key Research and Development Program of China (Grant No. 2016YFB0400502)。
文摘A novel SiC double-trench metal-oxide-semiconductor field effect transistor(MOSFET) with integrated MOS-channel diode is proposed and investigated by Sentaurus TCAD simulation. The new SiC MOSFET has a trench gate and a stepped-trench source, and features an integrated MOS-channel diode on the top sidewall of the source trench(MT MOS). In the reverse conduction state, the MOS-channel diode turns on firstly to prevent the internal parasitic body diode being activated, and thus reduces the turn-on voltage VFand suppresses the bipolar degradation phenomena. The VFof1.70 V(@Ids=-100 A/cm^(2)) for the SiC MT MOS is 38.2% lower than that of SiC double-trench MOSFET(DT MOS).Meanwhile, the reverse recovery charge Qrrof the MT MOS is 58.7% lower than that of the DT MOS at Iload= 700 A/cm^(2),and thus the reverse recovery loss is reduced. Furthermore, owing to the modulation effect induced by the double trenches,the MT MOS preserves the same superior forward conduction and blocking performance as those of DT MOS, with 22.9% and 18.2% improvement on breakdown voltage and RON,spcompared to the trench gate MOSFET with planar integrated SBD(ST MOS).
