Flexible and Robust Functionalized Boron Nitride/Poly(p‑Phenylene Benzobisoxazole)Nanocomposite Paper with High Thermal Conductivity and Outstanding Electrical Insulation

With the rapid development of 5G information technology,thermal conductivity/dissipation problems of highly integrated electronic devices and electrical equipment are becoming prominent.In this work,“high-temperature solid-phase&diazonium salt decomposition”method is carried out to prepare benzidine-functionalized boron nitride(m-BN).Subsequently,m-BN/poly(pphenylene benzobisoxazole)nanofiber(PNF)nanocomposite paper with nacremimetic layered structures is prepared via sol–gel film transformation approach.The obtained m-BN/PNF nanocomposite paper with 50 wt%m-BN presents excellent thermal conductivity,incredible electrical insulation,outstanding mechanical properties and thermal stability,due to the construction of extensive hydrogen bonds andπ–πinteractions between m-BN and PNF,and stable nacre-mimetic layered structures.Itsλ∥andλ_(⊥)are 9.68 and 0.84 W m^(-1)K^(-1),and the volume resistivity and breakdown strength are as high as 2.3×10^(15)Ωcm and 324.2 kV mm^(-1),respectively.Besides,it also presents extremely high tensile strength of 193.6 MPa and thermal decomposition temperature of 640°C,showing a broad application prospect in high-end thermal management fields such as electronic devices and electrical equipment.

Lightweight,Flexible Cellulose-Derived Carbon Aerogel@Reduced Graphene Oxide/PDMS Composites with Outstanding EMI Shielding Performances and Excellent Thermal Conductivities

In order to ensure the operational reliability and infor-mation security of sophisticated electronic components and to protect human health,efficient electromagnetic interference(EMI)shielding materials are required to attenuate electromagnetic wave energy.In this work,the cellulose solution is obtained by dissolving cotton through hydrogen bond driving self-assembly using sodium hydroxide(NaOH)/urea solution,and cellulose aerogels(CA)are prepared by gelation and freeze-drying.Then,the cellulose carbon aerogel@reduced graphene oxide aerogels(CCA@rGO)are prepared by vacuum impregnation,freeze-drying followed by thermal annealing,and finally,the CCA@rGO/polydimethylsiloxane(PDMS)EMI shielding composites are prepared by backfilling with PDMS.Owing to skin-core structure of CCA@rGO,the complete three-dimensional(3D)double-layer con-ductive network can be successfully constructed.When the loading of CCA@rGO is 3.05 wt%,CCA@rGO/PDMS EMI shielding composites have an excellent EMI shielding effectiveness(EMI SE)of 51 dB,which is 3.9 times higher than that of the co-blended CCA/rGO/PDMS EMI shielding composites(13 dB)with the same loading of fillers.At this time,the CCA@rGO/PDMS EMI shielding composites have excellent thermal stability(T_(HRI) of 178.3℃)and good thermal conductivity coefficient(λ of 0.65 W m^(-1) K^(-1)).Excellent comprehensive performance makes CCA@rGO/PDMS EMI shielding composites great prospect for applications in lightweight,flexible EMI shielding composites.

Breaking Through Bottlenecks for Thermally Conductive Polymer Composites:A Perspective for Intrinsic Thermal Conductivity,Interfacial Thermal Resistance and Theoretics

Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)values of prepared thermally conductive polymer composites are still difficult to achieve expectations,which has become the bottleneck in the fields of thermally conductive polymer composites.Aimed at that,based on the accumulation of the previous research works by related researchers and our research group,this paper proposes three possible directions for breaking through the bottlenecks:(1)preparing and synthesizing intrinsically thermally conductive polymers,(2)reducing the interfacial thermal resistance in thermally conductive polymer composites,and(3)establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization.Also,the future development trends of the three above-mentioned directions are foreseen,hoping to provide certain basis and guidance for the preparation,researches and development of thermally conductive polymers and their composites.

Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity

The development of lightweight and integration for electronics requires flexible films with high thermal conductivity and electromagnetic interference(EMI) shielding to overcome heat accumulation and electromagnetic radiation pollution.Herein,the hierarchical design and assembly strategy was adopted to fabricate hierarchically multifunctional polyimide composite films,with graphene oxide/expanded graphite(GO/EG) as the top thermally conductive and EMI shielding layer,Fe_(3)O_(4)/polyimide(Fe_(3)O_(4)/PI) as the middle EMI shielding enhancement layer and electrospun PI fibers as the substrate layer for mechanical improvement.PI composite films with 61.0 wt% of GO/EG and 23.8 wt% of Fe_(3)O_(4)/PI exhibits high in-plane thermal conductivity coefficient(95.40 W(m K)^(-1)),excellent EMI shielding effectiveness(34.0 dB),good tensile strength(93.6 MPa) and fast electric-heating response(5 s).The test in the central processing unit verifies PI composite films present broad application prospects in electronics fields.

Mechanically strong and folding-endurance Ti_(3)C_(2)T_(x) MXene/PBO nanofiber films for efficient electromagnetic interference shielding and thermal management

Electromagnetic interference(EMI)shielding materials with excellent flexibility and mechanical properties and outstanding thermal conductivity have become a hot topic of research in functional composites.In this study,the“sol-gel-film conversion technique”is used to assemble polyetherimidefunctionalized Ti_(3)C_(2)T_(x) nanosheets(f-Ti_(3)C_(2)T_(x))with poly(p-phenylene-2,6-benzobisoxazole)(PBO)nanofibers(PNFs),followed by dialysis and vacuum drying to prepare f-Ti_(3)C_(2)T_(x)/PNF films with lamellar structures.When the loading of f-Ti_(3)C_(2)T_(x) is 70 wt%,the f-Ti_(3)C_(2)T_(x)/PNF film presents optimal comprehensive properties,with an EMI shielding effectiveness(SE)of 35 dB and a specific SE/thickness((SSE,SE/density)/t)of 8211 dB cm^(2)/g,a tensile strength of 125.1 MPa,an in-plane thermal conductivity coefficient(λ)of 5.82 W/(m K),and electrical conductivity of 1943 S/m.After repeated folding for 10,000 cycles,the EMI SE and the tensile strength of f-Ti_(3)C_(2)T_(x)/PNFs films still remain 33.4 dB and 116.1 MPa,respectively.Additionally,the f-Ti_(3)C_(2)T_(x)/PNF film also shows excellent thermal stability,flame retardancy,and structural stability.This would provide a novel method for the design and fabrication of multifunctional composite films and considerably expand the applications of MXene-and PNF-based composites in the fields of EMI shielding and thermal management.

Advances in 3D printing for polymer composites:A review

The potential of three-dimensional(3D)printing technology in the fabrication of advanced polymer composites is becoming increasingly evident.This review discusses the latest research developments and applications of 3D printing in polymer composites.First,it focuses on the optimization of 3D printing technology,that is,by upgrading the equipment or components or adjusting the printing parameters,to make them more adaptable to the processing characteristics of polymer composites and to improve the comprehensive performance of the products.Second,it focuses on the 3D printable novel consumables for polymer composites,which mainly include the new printing filaments,printing inks,photosensitive resins,and printing powders,introducing the unique properties of the new consumables and different ways to apply them to 3D printing.Finally,the applications of 3D printing technology in the preparation of functional polymer composites(such as thermal conductivity,electromagnetic interference shielding,biomedicine,self-healing,and environmental responsiveness)are explored,with a focus on the distribution of the functional fillers and the influence of the topological shapes on the properties and functional characteristics of the 3D printed products.The aim of this review is to deepen the understanding of the convergence between 3D printing technology and polymer composites and to anticipate future trends and applications.

MXene-based fibers:Preparation,applications,and prospects

With the vigorous development and huge demand for portable wearable devices,wearable electronics based on functional fibers continue to emerge in a wide range of energy storage,motion monitoring,disease prevention,electromagnetic interference(EMI)shielding,etc.MXene,as an emerging twodimensional inorganic compound,has shown great potential in functional fiber manufacturing and has attracted much research attention due to its own good mechanical properties,high electrical conductivity,excellent electrochemical properties and favorable processability.Herein,this paper reviews recent advances of MXene-based fibers.Speaking to MXene dispersions,the properties of MXene dispersions including dispersion stability,rheological properties and liquid crystalline properties are highlighted.The preparation techniques used to produce MXene-based fibers and application progress regarding MXene-based fibers into supercapacitors,sensors,EMI shielding and Joule heaters are summarized.Challenges and prospects surrounding the development of MXene-based fibers are proposed in future.This review aims to provide processing guidelines for MXene-based fiber manufacturing,thereby achieving more possibilities of MXene-based fibers in advanced applications with a view to injecting more vitality into the field of smart wearables.

导热/吸波一体化高分子复合材料的研究进展和机理分析

高分子复合材料由于其功能多样、性能稳定、可加工性强等优点,在电子电气领域具有重要的应用.随着5G时代电子产品的小型化和高功率化发展,导致其狭小内部空间的热积聚和电磁波辐射问题愈发严重,传统解决方法是分别使用导热和电磁波吸收功能高分子复合材料,但是难以满足电子产品的小型化、轻薄化发展趋势对多功能一体化材料的迫切需求.因此,设计制备导热/吸波一体化高分子复合材料对于解决电子产品热积聚和电磁污染问题、适应电子产品发展趋势至关重要.本综述总结了导热/吸波一体化高分子复合材料的最新研究成果,分析了影响其导热/吸波性能的因素,并对其导热/吸波机理做了深入的剖析.着重讨论了制约导热/吸波一体化高分子复合材料发展的若干因素,并针对性地提出了解决方案和发展方向,旨在为高性能导热/吸波一体化高分子复合材料发展提供参考价值.

Thermally conductive polyvinyl alcohol composite films via introducing hetero-structured MXene@silver fillers

Ag nanoparticles were in-situ grown on the surface of MXene nanosheets to prepare thermally conductive hetero-structured MXene@Ag fillers.With polyvinyl alcohol(PVA)as the polymer matrix,thermally conductive MXene@Ag/PVA composite films were fabricated by the processes of solution blending,pouring,evaporative self-assembly.With the same mass fraction,MXene@Ag-III(MXene/Ag,2:1,w/w)presents more significant improvement in thermal conductivity coefficient(λ)than MXene@Ag,single MXene,Ag,simply blending MXene/Ag.MXene@Ag-III/PVA composite films show dual functions of excellent thermal conductivity and electromagnetic interference(EMI)shielding.When the mass fraction of MXene@Ag-III is 60 wt.%,the in-planeλ(λ_(∥)),through-planeλ(λ_(⊥)),EMI shielding effectiveness(EMI SE)are 3.72 and 0.41 W/(m∙K),32 dB,which are increased by 3.1,1.3,105.7 times than those of pure PVA film(0.91 and 0.18 W/(m∙K),0.3 dB),respectively.The 60 wt.%MXene@Ag-III/PVA composite film also has satisfying mechanical and thermal properties,with Young’s modulus,glass transition temperature,heat resistance index of 3.8 GPa,58.5 and 175.3℃,respectively.

3D打印调控铜线/聚乳酸复合材料的导热通路长度和数量

导热通路对理解导热高分子复合材料的导热行为至关重要,但目前有关导热通路属性(长度、数量)对高分子复合材料导热系数的影响机制缺乏深入研究.本文采用3D打印技术制备了铜线(Cw)导热通路长度和数量可控的一维铜线/聚乳酸(1D-Cw/PLA)导热复合材料,建立了针对一维导热通路的高分子复合材料的导热模型,明晰了其导热通路属性与其导热性能的定量关系.相同Cw用量下,1D-Cw/PLA导热复合材料的面内导热系数与导热通路的数量和长度呈正相关.采用本文构建的导热模型和经验方程对1D-Cw/PLA复合材料的导热系数进行预测,95%的置信度表明预测值与实测值无显著差异.

Janus(BNNS/ANF)-(AgNWs/ANF)thermal conductivity composite films with superior electromagnetic interference shielding and Joule heating performances

Highly thermal conductivity materials with excellent electromagnetic interference shielding and Joule heating performances are ideal for thermal management in the next generation of communication industry,artificial intelligence and wearable electronics.In this work,silver nanowires(AgNWs)are prepared using silver nitrate as the silver source and ethylene glycol as the solvent and reducing agent,and boron nitride(BN)is performed to prepare BN nanosheets(BNNS)with the help of isopropyl alcohol and ultrasonication-assisted peeling method,which are compounded with aramid nanofibers(ANF)prepared by chemical dissociation,respectively,and the(BNNS/ANF)-(AgNWs/ANF)thermal conductivity and electromagnetic interference shielding composite films with Janus structures are prepared by the"vacuum-assisted filtration and hot-pressing"method.Janus(BNNS/ANF)-(AgNWs/ANF)composite films exhibit"one side insulating,one side conducting"performance,the surface resistivity of the BNNS/ANF surface is 4.7×10^(13) Ω,while the conductivity of the AgNWs/ANF surface is 5,275 S/cm.And Janus(BNNS/ANF)-(AgNWs/ANF)composite film with thickness of 95 pm has a high in-plane thermal conductivity coefficient of 8.12 W/(m·K)and superior electromagnetic interference shielding effectiveness of 70 dB.The obtained composite film also has excellent tensile strength of 122.9 MPa and tensile modulus and 2.7 GPa.It also has good temperature-voltage response characteristics(high Joule heating temperature at low supply voltage(5 V,215.0℃),fast response time(10 s)),excellent electrical stability and reliability(stable and constant real-time relative resistance under up to 300 cycles and 1,500 s of tensile-bending fatigue work tests).

Multifunctional Ti_(3)C_(2)T_(x)-(Fe_(3)O_(4)/polyimide)composite films with Janus structure for outstanding electromagnetic interference shielding and superior visual thermal management

Flexible multifunctional polymer-based electromagnetic interference(EMI)shielding composite films have important application values in the fields of 5G communication technology,wearable electronic devices and artificial intelligence.In this work,Fe_(3)O_(4)/polyamic acid(PAA)nanofiber films are prepared by in-situ polymerization and electrospinning technology,and Ti_(3)C_(2)T_(x)nanosheets are deposited on the surface of the Fe_(3)O_(4)/PAA nanofiber films via vacuum-assisted filtration.Then,Janus Ti_(3)C_(2)T_(x)-(Fe_(3)O_(4)/polyimide(PI))composite films are obtained by thermal imidization.The two sides of the Janus films exhibit completely different properties.The Fe_(3)O_(4)/PI side has excellent hydrophobicity and insulation property,and the Ti_(3)C_(2)T_(x)side has hydrophilicity and terrific conductivity.When the mass fraction of Ti_(3)C_(2)T_(x)is 80 wt.%,the Janus Ti_(3)C_(2)T_(x)-(Fe_(3)O_(4)/PI)composite film has excellent EMI shielding performances and mechanical properties,with EMI shielding effectiveness,tensile strength and Young’s modulus reaching 66 dB,114.5 MPa and 5.8 GPa,respectively.At the same time,electromagnetic waves show different absorption shielding effectiveness(SEA)when incident from two sides of the Janus films.When the electromagnetic waves are incident from the Fe_(3)O_(4)/PI side,the SEA of the Janus film is 58 dB,much higher than that when the electromagnetic waves are incident from the Ti_(3)C_(2)T_(x)side(39 dB).In addition,the Ti_(3)C_(2)T_(x)side of the Janus Ti_(3)C_(2)T_(x)-(Fe_(3)O_(4)/PI)composite films also has excellent electrothermal and photothermal conversion performances.When the applied voltage is 4 V,the stable surface temperature reaches 108°C;when it is irradiated by simulated sunlight with power density of 200 mW/cm2,the stable surface temperature reaches 95℃.

A mini-review of MXene porous films:Preparation,mechanism and application

MXene presents excellent electrical conductivity,abundant surface functional groups and wonderful filmforming performance,but the lamellar layers are prone to self-stacking during film formation,which will reduce the loss of electromagnetic waves,hinder ion transmission,and limit the effective load of other functional materials.The construction of the porous structure can effectively solve the self-stacking problem of MXene sheets.This article reviews the research progress of MXene porous films for electromagnetic interference(EMI)shielding,lithium/sodium ion batteries,pseudocapacitors,and biomedical science applications.It focuses on the preparation methods of MXene porous films,and discusses the pore-forming mechanism of the porous structure formed by different preparation methods and the internal relationship between the“microstructure-macroscopic performance”of the MXene porous films,points out the key scientific and technical bottlenecks that need to be solved urgently in the preparation and application of the MXene porous films.It is hoped to provide certain guidance for the design,preparation,optimization,industrial application,and development of MXene porous films.

Improvement of thermal conductivities and simulation model for glass fabrics reinforced epoxy laminated composites via introducing hetero-structured BNN-30@BNNS fillers

Hetero-structured thermally conductive spherical boron nitride and boron nitride nanosheets(BNN-30@BNNS)fillers were prepared via electro static self-assembly method.And the corresponding thermally conductive&electrically insulating BNN-30@BNNS/Si-GFs/E-44 laminated composites were then fabricated via hot compression.BNN-30@BNNS-Ⅲ(fBNN-30/fBNNS,1/2,wt/wt)fillers presented the optimal synergistic improvement effects on the thermal conductivities of epoxy composites.When the mass fraction of BNN-30@BNNS-Ⅲwas 15 wt%,λvalue of the BNN-30@BNNS-Ⅲ/E-44 composites was up to0.61 W m^(-1)K^(-1),increased by 2.8 times compared with pure E-44(λ=0.22 W m^(-1)K^(-1)),also higher than that of the 15 wt%BNN-30/E-44(0.56 W m^(-1)K^(-1)),15 wt%BNNS/E-44(0.42 W m^(-1)K^(-1)),and 15 wt%(BNN-30/BNNS)/E-44(direct blending BNN-30/BNNS hybrid fillers,1/2,wt/wt,0.49 W m^(-1)K^(-1))composites.Theλin-plane(λ//)andλcross-plane(λ_(⊥))of 15 wt%BNN-30@BNNS-Ⅲ/Si-GFs/E-44 laminated composites significantly reached 2.75 W m^(-1)K^(-1)and 1.32 W m^(-1)K^(-1),186.5%and 187.0%higher than those of Si-GFs/E-44 laminated composites(λ//=0.96 W m^(-1)K^(-1)andλ_(⊥)=0.46 W m^(-1)K^(-1)).Established models can well simulate heat transfer efficiency in the BNN-30@BNNS-Ⅲ/Si-GFs/E-44 laminated composites.Under the condition of point heat source,the introduction of BNN-30@BNNS-Ⅲfillers were conducive to accelerating heat flow trans fe r.BNN-30@BNNS-Ⅲ/Si-GFs/E-44 laminated composites also demonstrated outstanding electrical insulating properties(cross-plane withstanding voltage,breakdown strength,surface&volume resistivity of 51.3 kV,23.8 kV mm^(-1),3.7×10^(14)Ω&3.4×10^(14)Ω·cm,favorable mechanical properties(flexural strength of 401.0 MPa and ILSS of 22.3 MPa),excellent dielectric properties(εof 4.92 and tanδof 0.008)and terrific thermal properties(T_(g )of 167.3℃and T_(HRI) of 199.2℃).

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

The developing flexible electronic equipment are greatly affected by the rapid accumulation of heat,which is urgent to be solved by thermally conductive polymer composite films.However,the interfacial thermal resistance(ITR)and the phonon scattering at the interfaces are the main bottlenecks limiting the rapid and efficient improvement of thermal conductivity coefficients(λ)of the polymer composite films.Moreover,few researches were focused on characterizing ITR and phonon scattering in thermally conductive polymer composite films.In this paper,graphene oxide(GO)was aminated(NH_(2)-GO)and reduced(NH_(2)-rGO),then NH_(2)-rGO/polyimide(NH_(2)-rGO/PI)thermally conductive composite films were fabricated.Raman spectroscopy was utilized to innovatively characterize phonon scattering and ITR at the interfaces in NH_(2)-rGO/PI thermally conductive composite films,revealing the interfacial thermal conduction mechanism,proving that the amination optimized the interfaces between NH_(2)-rGO and PI,reduced phonon scattering and ITR,and ultimately improved the interfacial thermal conduction.The in-planeλ(λ∥)and through-planeλ(λ_(⊥))of 15 wt%NH_(2)-rGO/PI thermally conductive composite films at room temperature were,respectively,7.13 W/mK and 0.74 W/mK,8.2 timesλ∥(0.87 W/mK)and 3.5 timesλ_(⊥)(0.21 W/mK)of pure PI film,also significantly higher thanλ∥(5.50 W/mK)andλ_(⊥)(0.62 W/mK)of 15 wt%rGO/PI thermally conductive composite films.Calculation based on the effective medium theory model proved that ITR was reduced via the amination of rGO.Infrared thermal imaging and finite element simulation showed that NH_(2)-rGO/PI thermally conductive composite films obtained excellent heat dissipation and efficient thermal management capabilities on the light-emitting diodes bulbs,5G high-power chips,and other electronic equipment,which are easy to generate heat severely.

Flexible Ti_(3)C_(2)T_(x)/(Aramid Nanofiber/PVA)Composite Films for Superior Eectromagnetic Interference Shielding

Multifunctional electromagnetic interference(EMI)shielding materials would solve electromagnetic radiation and pollution problemsfrom electronicdevices.Herein,the directionalfreezedryingtechnology isutilizedtoprepare the aramid nanofber/polyvinyl alcohol aerogel with a directionally porous structure(D-ANF/PVA),and the Ti_(3)C_(2)T_(x)dispersion is fully immersed into the D-ANF/PVA aerogel via ultrasonication and vacuum-assisted impregnation.Ti_(3)C_(2)T_(x)/(ANF/PVA)EMI shielding composite films with directionally ordered structure(D-Ti_(3)C_(2)T_(x)/(ANF/PVA)are then prepared by freeze-drying and hot pressing.Constructinga directionally porous structure enables the highly conductive TiCnanosheets to be wrapped on the directionally porous D-ANF/PVA framework in order arrangement and overlapped with each other.And the hot pressing process effectively reduces the layer spacing between the stacked wavy D-ANF/PVA,to form a large number of TiCT T_(3)C_(2)T_(x)continuous conductive paths,which significantly improves the conductivity of the D-Ti_(3)C_(2)T_(x)/(ANF/PVA)EMI shielding composite film,When the amount of Ti_(3)C_(2)T_(x)is 80 wt%,the EMI shielding efectiveness(EMil SE)and specifc SE(SSE/t)of D-Ti_(3)C_(2)T_(x)/(ANF/PVA)EMI shielding composite film achieve 70 dB and 13790 dB-cmg(thickness and density of 120μm and 0.423g·cm^(-3))。far superior to random-structured T_(3)C_(2)T_(x)/(ANF/PVA)(R-TJCTM(ANF/PVA))composite film(46 dB and 9062 dBcm·g^(-3),respectively)via blending-freeze-drying followed by hot pressing technology.Meanwhile,the D-TiCTJMANF/PVA)EMII shielding composite flm possesses excellent flexibility and foldability.

Liquid crystalline texture and hydrogen bond on the thermal conductivities of intrinsic thermal conductive polymer films

Polymer-dispersed liquid crystal(PDLC)films comprising polyvinyl alcohol(PVA)and liquid crystal monomer(LCM)were successfully obtained by the method of solution casting&thermal compressing.LCM was distributed orderly in PVA matrix by hydrogen bond interaction,to form PVA-LCM interpe net rating-layered networks.When the mass fraction of LCM was up to 35 wt%,the corresponding in-plane thermal conductivity coefficient(λ//)of PDLC film was significantly increased to 1.41 W m^(-1)K^(-1),about 10.8 times that of neat PVA(0.13 W m^(-1)K^(-1)).High intrinsicλ//values of PDLC films were mainly attributed to the formed microscopic-ordered structures from ordered stacking of LCM,ordered arrangement of PVA chains,and their hydrogen bond interaction.This work would offer a new way to design and prepare novel intrinsic high thermal conductive polymers.

Enhanced Thermal Conductivities of Liquid Crystal Polyesters from Controlled Structure of Molecular Chains by Introducing Different Dicarboxylic Acid Monomers

Enhancing thermal conductivity coefficient (λ) of liquid crystal polyesters would further widen their application in electronics and electricals. In this work, a kind of biphenyl-based dihydroxy monomer is synthesized using 4, 4’-biphenyl (BP) and triethylene glycol (TEG) as raw material, which further reacts with three different dicarboxylic acids (succinic acid, p-phenylenediacetic acid, and terephthalic acid, respectively) by melt polycondensation to prepare intrinsically highly thermally conductive poly 4’, 4”’-[1, 2-ethanediyl-bis(oxy-2, 1-ethanediyloxy)]-bis(p-hydroxybiphenyl) succinate (PEOS), poly 4’, 4”’-[1, 2-ethanediyl-bis(oxy-2, 1-ethanediyloxy)]-bis(p-hydroxybiphenyl) p-phenyldiacetate (PEOP) and poly 4’, 4”’-[1, 2-ethanediyl-bis(oxy-2, 1-ethanediyloxy)]-bis(p-hydroxybiphenyl) terephthalate (PEOT), collectively called biphenyl-based liquid crystal polyesters (B-LCPE). The results show that B-LCPE possess the desired molecular structure, exhibit smectic phase in liquid crystal range and semicrystalline polymers at room temperature, and possess excellent intrinsic thermal conductivities, thermal stabilities, and mechanical properties. λ of PEOT is 0.51 W/(m·K), significantly exceeds that of polyethylene terephthalate (0.15 W/(m·K)) which has similar molecular structure with PEOT, and also higher than that of PEOS (0.32 W/(m·K)) and PEOP (0.38 W/(m·K)). The corresponding heat resistance index (THRI), elasticity modulus, and hardness of PEOT are 174.6℃, 3.6 GPa, and 154.5 MPa, respectively, and also higher than those of PEOS (162.2℃, 1.8 GPa, and 83.4 MPa) and PEOP (171.8℃, 2.3 GPa, and 149.6 MPa).

Highly thermally conductive carbon nanotubes pillared exfoliated graphite/polyimide composites

In this work,carbon nanotubes pillared grew on exfoliated graphite by the microwave-assisted method is utilized as thermally conductive fillers(CPEG)in polyimide(PI)to fabricate CPEG/PI thermally conductive composites with the combining ways of“in-situ polymerization,electrospinning,lay-up,and hot-pressing”.The prepared CPEG/PI composites realized the maximum thermal conductivity(λ,1.92Wm^(−1)K^(−1))at low CPEG amount(10 wt%),much higher than that of pure PI(0.28Wm^(−1)K^(−1)).Theλof CPEG/PI composites show almost no change after 1000 cycles of heating and cooling at the temperature of 25−100°C.The finite element analysis simulates the nano-/microscale heat transfer in CPEG/PI composites to reveal the internal reason of theλenhancement.The improved thermal conductivity model and empirical equation could better reflect the actualλchange trend of CPEG/PI composites.The actual application test shows the CPEG/PI composites could significantly reduce the operating temperature of the CPU in mobile phone.