Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10...Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10 rain at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 rain during furnace cooling. After analyzing interface, the feasible diffusion bonding temperature was suggested as 823 K. The three major intermetallic layers generated during diffusion bonding process were identified as AIECu, AlCu＋AlaCu4 and Al4Cu9. Furthermore, local hardness values ofAlECU, AlCu＋AlaCu4 and Al4Cu9 layers average at （4.97±0.05）, （6.33±0.00） and （6.06±0.18） GPa, respectively.展开更多
The effects of reduction ratio during roll bonding on the microstructural evolution at interface and subsequent mechanical properties of roll-bonded Al/Cu 2-ply sheets were investigated. The interface microstructures ...The effects of reduction ratio during roll bonding on the microstructural evolution at interface and subsequent mechanical properties of roll-bonded Al/Cu 2-ply sheets were investigated. The interface microstructures for several Al/Cu 2-ply sheets fabricated under different reduction ratios between 30% and 65% were verified by transmission electron microscopy(TEM). Taking the difference of interface microstructure into consideration, 3-point bending and peel tests were performed for obtaining flexural and bonding strengths for Al/Cu 2-ply sheets. The effect of the quantified areas of metallurgical bonding at interfaces on the bonding strength was also discussed. The results show that both the bonding and flexural strengths for Al/Cu 2-ply sheets are reduced by decreasing the reduction ratio during the roll bonding process, which is strongly correlated with the interface microstructure. This was especially verified by observing the interface delamination from the 3-point bent samples.展开更多
The contribution of chemical compositions in terms of carbon equivalent value（CEV） on impending crack propagation during weld bead bend tests（WBBTs） was studied with five different high-strength lowalloy steel pla...The contribution of chemical compositions in terms of carbon equivalent value（CEV） on impending crack propagation during weld bead bend tests（WBBTs） was studied with five different high-strength lowalloy steel plates that underwent different rolling processes. The test showed that cracks developed at the weld joint, easily passed through the coarse-grain heat-affected zone（CGHAZ）, and finally were arrested within the heat-affected zone（HAZ）. An apparent decrease in the average crack length, which consequently indicated improvement in crack arrestability, was found with decreasing CEV. In addition,the relatively fine microstructure in the HAZ of low-CEV steel plates helped in preventing the crack from further propagation. Special emphasis was placed on the empirical expectation of critical CEV above which WBBT might fail.展开更多
基金Project (10037273) supported by the Ministry of Knowledge Economy, Korea
文摘Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10 rain at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 rain during furnace cooling. After analyzing interface, the feasible diffusion bonding temperature was suggested as 823 K. The three major intermetallic layers generated during diffusion bonding process were identified as AIECu, AlCu＋AlaCu4 and Al4Cu9. Furthermore, local hardness values ofAlECU, AlCu＋AlaCu4 and Al4Cu9 layers average at （4.97±0.05）, （6.33±0.00） and （6.06±0.18） GPa, respectively.
基金Project(10037273) supported by the Ministry of Knowledge Economy,Korea
文摘The effects of reduction ratio during roll bonding on the microstructural evolution at interface and subsequent mechanical properties of roll-bonded Al/Cu 2-ply sheets were investigated. The interface microstructures for several Al/Cu 2-ply sheets fabricated under different reduction ratios between 30% and 65% were verified by transmission electron microscopy(TEM). Taking the difference of interface microstructure into consideration, 3-point bending and peel tests were performed for obtaining flexural and bonding strengths for Al/Cu 2-ply sheets. The effect of the quantified areas of metallurgical bonding at interfaces on the bonding strength was also discussed. The results show that both the bonding and flexural strengths for Al/Cu 2-ply sheets are reduced by decreasing the reduction ratio during the roll bonding process, which is strongly correlated with the interface microstructure. This was especially verified by observing the interface delamination from the 3-point bent samples.
文摘The contribution of chemical compositions in terms of carbon equivalent value（CEV） on impending crack propagation during weld bead bend tests（WBBTs） was studied with five different high-strength lowalloy steel plates that underwent different rolling processes. The test showed that cracks developed at the weld joint, easily passed through the coarse-grain heat-affected zone（CGHAZ）, and finally were arrested within the heat-affected zone（HAZ）. An apparent decrease in the average crack length, which consequently indicated improvement in crack arrestability, was found with decreasing CEV. In addition,the relatively fine microstructure in the HAZ of low-CEV steel plates helped in preventing the crack from further propagation. Special emphasis was placed on the empirical expectation of critical CEV above which WBBT might fail.
