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Research on the Optimization of Green Building Performance Based on BIM Technology
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作者 le lv 《Journal of World Architecture》 2024年第2期160-165,共6页
With the acceleration of urbanization,the construction industry has developed rapidly worldwide but has also brought serious environmental problems.Traditional architectural design methods often only focus on the func... With the acceleration of urbanization,the construction industry has developed rapidly worldwide but has also brought serious environmental problems.Traditional architectural design methods often only focus on the function and beauty of the building while ignoring its impact on the environment.In addition,the lack of effective design and construction management methods also led to high resource and energy consumption.To overcome this challenge,the concept of green building came into being.Green buildings emphasize reducing the negative impact of buildings on the environment and improving resource utilization efficiency throughout the entire life cycle.BIM technology provides strong support for achieving this goal.Based on this,starting from the role of BIM technology in green building performance optimization,this article analyzes the optimization of green building performance solutions based on BIM technology in detail to promote the sustainable development of buildings. 展开更多
关键词 BIM technology Green building Performance solution optimization
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Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction
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作者 Wen Dai Xing-Jie Ren +13 位作者 Qingwei Yan Shengding Wang Mingyang Yang le lv Junfeng Ying Lu Chen Peidi Tao Liwen Sun Chen Xue Jinhong Yu Chengyi Song Kazuhito Nishimura Nan Jiang Cheng-Te Lin 《Nano-Micro Letters》 SCIE EI CAS CSCD 2023年第1期183-196,共14页
Developing advanced thermal interface materials(TIMs)to bridge heat-generating chip and heat sink for constructing an efficient heat transfer interface is the key technology to solve the thermal management issue of hi... Developing advanced thermal interface materials(TIMs)to bridge heat-generating chip and heat sink for constructing an efficient heat transfer interface is the key technology to solve the thermal management issue of high-power semiconductor devices.Based on the ultra-high basal-plane thermal conductivity,graphene is an ideal candidate for preparing high-performance TIMs,preferably to form a vertically aligned structure so that the basal-plane of graphene is consistent with the heat transfer direction of TIM.However,the actual interfacial heat transfer efficiency of currently reported vertically aligned graphene TIMs is far from satisfactory.In addition to the fact that the thermal conductivity of the vertically aligned TIMs can be further improved,another critical factor is the limited actual contact area leading to relatively high contact thermal resistance(20-30 K mm^(2) W^(−1))of the“solid-solid”mating interface formed by the vertical graphene and the rough chip/heat sink.To solve this common problem faced by vertically aligned graphene,in this work,we combined mechanical orientation and surface modification strategy to construct a three-tiered TIM composed of mainly vertically aligned graphene in the middle and micrometer-thick liquid metal as a cap layer on upper and lower surfaces.Based on rational graphene orientation regulation in the middle tier,the resultant graphene-based TIM exhibited an ultra-high thermal conductivity of 176 W m^(−1) K^(−1).Additionally,we demonstrated that the liquid metal cap layer in contact with the chip/heat sink forms a“liquid-solid”mating interface,significantly increasing the effective heat transfer area and giving a low contact thermal con-ductivity of 4-6 K mm^(2) W^(−1) under packaging conditions.This finding provides valuable guidance for the design of high-performance TIMs based on two-dimensional materials and improves the possibility of their practical application in electronic thermal management. 展开更多
关键词 Vertically aligned graphene Liquid metal Surface modification Thermal interface materials
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Enhancement of in-plane thermal conductivity of flexible boron nitride heat spreaders by micro/nanovoid filling using deformable liquid metal nanoparticles
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作者 Pei-Di Tao Shao-Gang Wang +13 位作者 Lu Chen Jun-Feng Ying le lv Li-Wen Sun Wu-Bo Chu Kazuhito Nishimura Li Fu Yue-Zhong Wang Jin-Hong Yu Nan Jiang Wen Dai Yao-Kang lv Cheng-Te Lin Qing-Wei Yan 《Rare Metals》 SCIE EI CAS CSCD 2023年第11期3662-3672,共11页
With the fast development of integrated circuit devices as well as batteries with high energy densities,the thermal management of electronic components is becoming increasingly crucial to maintaining their reliable op... With the fast development of integrated circuit devices as well as batteries with high energy densities,the thermal management of electronic components is becoming increasingly crucial to maintaining their reliable operations.Boron nitride nanosheets(BNNS),which have superhigh thermal conductivity along the in-plane direction while remaining electrically insulating,were widely regarded as an ideal filler for preparing high-performance polymer composites to address the‘‘thermal failure''issue.However,due to the instinctive rigidity of BNNS,the nanosheets are unable to form a tightly interfacial contact between the adjoining fillers,resulting in some micro-and nanovoids within the heat transfer pathways and severely limiting further thermal conductivity enhancement for BNNS-based composites.Herein,soft and deformable liquid metal(eutectic gallium-indium,EGaIn)nanoparticles were employed to fill the gaps between the adjacent BNNS with a rational design of mass ratios of BNNS and EGaIn,leading to a strongly synergistic effect with BNNS on thermal conductivity improvement.As a result,the composite film(BNNS:63 wt%and EGaIn:7 wt%)employing cellulose nanofibers(CNF:30 wt%)as the polymer matrix achieves superhigh thermal conductivity along the in-plane direction of up to(90.51±6.71)W·m^(-1)·K^(-1),showing the highest value among the BNNSbased composites with a bi-filler system as far as we know.Additionally,the film can work as a heat spreader for the heat dissipation of high-power light emitting diodes,outperforming tin foil in cooling efficiency. 展开更多
关键词 Boron nitride nanosheet Liquid metal Eutectic gallium-indium In-plane thermal conductivity Heat spreader
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Surfactant-assisted fabrication of graphene frameworks endowing epoxy composites with superior thermal conductivity 被引量:2
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作者 Fan Zhang Chen Ye +9 位作者 Wen Dai le lv Qilong Yuan Kuan W.A.Chee Ke Yang Nan Jiang Cheng-Te Lin Zhaolin Zhan Dan Dai He Li 《Chinese Chemical Letters》 SCIE CAS CSCD 2020年第1期244-248,共5页
With the rapid growth in electronic device performance,there has been an increasing demand for thermally conductive polymer composites to handle the thermal management issue,thus contributing to the great importance t... With the rapid growth in electronic device performance,there has been an increasing demand for thermally conductive polymer composites to handle the thermal management issue,thus contributing to the great importance to develop the graphene framework,which is evaluated as the most promising reinforcements for enhancing the thermal conductivity of polymer.Vacuum filtration is a common method to fabricate graphene framework,whereas,it is available to prepare a framework with centimeter-scale thickness by filtrating the graphene-water dispersion,due to the fact of sample cracking caused by the mismatch of surface tension between graphene and water.In this work,a surfactantassisted strategy was proposed by adjusting the surface tension of the water close to that of graphene first,then performing a conventional filtration process,to fabricate graphene framework.As a result,a thick graphene framework(thickness:3 cm)was successfully prepared,and after embedding into epoxy,the framework endows the composite(13.6 wt%)with a high in-plane thermal conductivities of12.4 W/mK,which is equivalent to≈64 times higher than that of neat epoxy.Our method is simple and compatible with the conventional filtration process,suggesting great potential for the mass-production of graphene framework to meet the practical application requirements. 展开更多
关键词 Graphene framework SURFACTANT Vacuum filtration Thermal conductivity Polymer composite
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Quantitatively investigating the self-attraction of nanowires
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作者 Junfeng Cui Zhenyu Zhang +3 位作者 le lv Kazuhito Nishimura Guoxin Chen Nan Jiang 《Nano Research》 SCIE EI CSCD 2022年第4期3729-3736,共8页
The self-attraction of nanowires(NWs)would lead to NWs bunching up together when fabricated in high density and the short circuit of NW-based devices during service.However,the underlying mechanism of the self-attract... The self-attraction of nanowires(NWs)would lead to NWs bunching up together when fabricated in high density and the short circuit of NW-based devices during service.However,the underlying mechanism of the self-attraction of NWs remains debatable due to the lack of in situ characterization of the attraction.In this study,a versatile method of in situ investigating the self-attraction of NWs was developed.The attractive force between two NWs and their distance can be determined quantitatively in the process of attraction under an optical microscope,eliminating the influence of electron beam in electron microscopes.With this approach,the self-attraction of SiC NWs was investigated and a two-stage mechanism for the self-attraction was proposed.The electrostatic force between two individual SiC NWs increased as their distance decreased,and acted as the initial driving force for the attraction of NWs.SiC NWs remained in contact under van der Waals force until they separated when external force exceeded van der Waals force.The charge density and the Hamaker constant of SiC NWs were determined to be 1.9×10^(-4)C·m^(-2)and 1.56×10^(-19)J,which played an important role in the attraction of NWs.The results shed light on the mechanism of selfattraction among NWs and provide new insights into fabricating high-quality NWs and developing high-performance NW-based devices. 展开更多
关键词 self-attraction NANOWIRES in situ electrostatic force van der Waals force
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A Spiral Graphene Framework Containing Highly Ordered Graphene Microtubes for Polymer Composites with Superior Through-Plane Thermal Conductivity
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作者 Jinrui Gong Xue Tan +11 位作者 Qilong Yuan Zhiduo Liu Junfeng Ying le lv Qingwei Yan Wubo Chu Chen Xue Jinhong Yu Kazuhito Nishimura Nan Jiang Cheng-Te Lin Wen Dai 《Chinese Journal of Chemistry》 SCIE CAS CSCD 2022年第3期329-336,共8页
As the power density of electronic devices increases,there has been an urgent demand to develop highly conductive polymer composites to address the accompanying thermal management issues.Due to the ultra-high intrinsi... As the power density of electronic devices increases,there has been an urgent demand to develop highly conductive polymer composites to address the accompanying thermal management issues.Due to the ultra-high intrinsic thermal conductivity,graphene is considered a very promising filler to improve the thermal conductivity of polymers.However,graphene-based polymer composites prepared by the conventional mixing method generally have limited thermal conductivity,even under high graphene loading,due to the failure to construct efficient heat transfer pathways in the polymer matrix.Here,a spiral graphene framework(SGF)containing continuous and highly ordered graphene microtubes was developed based on a modified CVD method.After embedding into the epoxy(EP)matrix,the graphene microtubes can act as efficient heat pathways,endowing the SGF/EP composites with a high through-plane thermal conductivity of 1.35 W·m^(-1)·K^(-1) at an ultralow graphene loading of 0.86 wt%.This result gives a thermal conductivity enhancement per 1 wt%filler loading of 710%,significantly outperforming various graphene structures as fillers.In addition,we demonstrated the practical application of the SGF/EP composite as a thermal interface material for efficient thermal man-agement of the light-emitting diode(LED). 展开更多
关键词 GRAPHENE Chemical vapor deposition Polymer Thermal conductivity Thermal management material
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