A bisphenol A based epoxy was incorporated with a quadruply hydrogen bonded supramolecular polymer as a toughening agent to prepare a composite epoxy resin with higher impact resistance. The supramolecular polymer com...A bisphenol A based epoxy was incorporated with a quadruply hydrogen bonded supramolecular polymer as a toughening agent to prepare a composite epoxy resin with higher impact resistance. The supramolecular polymer comprising poly-（propylene glycol） bis（2-aminopropyl） ether chains and 2-ureido-4[1H]-pyrimidinone moieties（UPy） self-assembled into spherical domains with sizes of 300 nm to 600 nm in diameter by micro phase separation in bulk epoxy matrixes. A significant improvement of 300% in impact resistance of the supramolecular polymer incorporated epoxy resin was obtained when the content of supramolecular polymer was 10 wt%. Tensile tests showed that the mechanical properties of the modified epoxy resin containing the hydrogen-bonded supramolecular polymers are also improved compared with those of the neat epoxy resin.展开更多
Hydrogen bonding is considered to have significant effect on the interaction between polymeric chains and on the viscoelasticity of the polymeric materials. In this paper, we attempt to discuss the relationship betwee...Hydrogen bonding is considered to have significant effect on the interaction between polymeric chains and on the viscoelasticity of the polymeric materials. In this paper, we attempt to discuss the relationship between hydrogen bonding density and damping behavior and mechanical properties of polyethylene-based polymeric materials. For this reason, a series of pendant chain hydrogen bonding polymers （PCHBP） with different hydrogen bonding density （HBD） were prepared by quantitatively changing the content of pendent hydroxyl groups on the main chain of polyethylene. It was found that PCItBP with low HBD showed similar properties to polyethylene, indicating that the property of the materials was dependent mainly on the structure of the main chain. However, PCHBP with high HBD exhibited two tandpeaks and a platform of loss modulus as well as a high storage modulus （about 400 MPa） at the second tand peak temperature, demonstrating that a polymeric material with high strength and damping properties was obtained. More importantly, the maximum of loss modulus showed a linear increase with the HBD, indicating that a higher HBD greatly improved the damping properties of the polymeric materials.展开更多
文摘A bisphenol A based epoxy was incorporated with a quadruply hydrogen bonded supramolecular polymer as a toughening agent to prepare a composite epoxy resin with higher impact resistance. The supramolecular polymer comprising poly-（propylene glycol） bis（2-aminopropyl） ether chains and 2-ureido-4[1H]-pyrimidinone moieties（UPy） self-assembled into spherical domains with sizes of 300 nm to 600 nm in diameter by micro phase separation in bulk epoxy matrixes. A significant improvement of 300% in impact resistance of the supramolecular polymer incorporated epoxy resin was obtained when the content of supramolecular polymer was 10 wt%. Tensile tests showed that the mechanical properties of the modified epoxy resin containing the hydrogen-bonded supramolecular polymers are also improved compared with those of the neat epoxy resin.
基金supported by the National Natural Science Foundation of China(Nos.51003018 and 21374009)Program of International S&T Cooperation Special Project(No.2011DFR50770)the Fundamental Research Funds of the Central University(No.HEUCFJ161003)
文摘Hydrogen bonding is considered to have significant effect on the interaction between polymeric chains and on the viscoelasticity of the polymeric materials. In this paper, we attempt to discuss the relationship between hydrogen bonding density and damping behavior and mechanical properties of polyethylene-based polymeric materials. For this reason, a series of pendant chain hydrogen bonding polymers （PCHBP） with different hydrogen bonding density （HBD） were prepared by quantitatively changing the content of pendent hydroxyl groups on the main chain of polyethylene. It was found that PCItBP with low HBD showed similar properties to polyethylene, indicating that the property of the materials was dependent mainly on the structure of the main chain. However, PCHBP with high HBD exhibited two tandpeaks and a platform of loss modulus as well as a high storage modulus （about 400 MPa） at the second tand peak temperature, demonstrating that a polymeric material with high strength and damping properties was obtained. More importantly, the maximum of loss modulus showed a linear increase with the HBD, indicating that a higher HBD greatly improved the damping properties of the polymeric materials.
