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On the relationship between imprint and reliability in Hf_(0.5)Zr_(0.5)O_(2) based ferroelectric random access memory
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作者 Peng Yuan Yuting Chen +9 位作者 liguo chai Zhengying Jiao Qingjie Luan Yongqing Shen Ying Zhang Jibin Leng Xueli Ma Jinjuan Xiang Guilei Wang Chao Zhao 《Journal of Semiconductors》 EI CAS CSCD 2024年第4期42-47,共6页
The detrimental effect of imprint,which can cause misreading problem,has hindered the application of ferroelectric HfO_(2).In this work,we present results of a comprehensive reliability evaluation of Hf_(0.5)Zr_(0.5)O... The detrimental effect of imprint,which can cause misreading problem,has hindered the application of ferroelectric HfO_(2).In this work,we present results of a comprehensive reliability evaluation of Hf_(0.5)Zr_(0.5)O_(2)-based ferroelectric random access memory.The influence of imprint on the retention and endurance is demonstrated.Furthermore,a solution in circuity is pro-posed to effectively solve the misreading problem caused by imprint. 展开更多
关键词 FERAM HZO IMPRINT RELIABILITY
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Implementation of sub-100 nm vertical channel-all-around(CAA) thin-film transistor using thermal atomic layer deposited IGZO channel
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作者 Yuting Chen Xinlv Duan +9 位作者 Xueli Ma Peng Yuan Zhengying Jiao Yongqing Shen liguo chai Qingjie Luan Jinjuan Xiang Di Geng Guilei Wang Chao Zhao 《Journal of Semiconductors》 EI CAS CSCD 2024年第7期40-44,共5页
In-Ga-Zn-O(IGZO) channel based thin-film transistors(TFT), which exhibit high on-off current ratio and relatively high mobility, has been widely researched due to its back end of line(BEOL)-compatible potential for th... In-Ga-Zn-O(IGZO) channel based thin-film transistors(TFT), which exhibit high on-off current ratio and relatively high mobility, has been widely researched due to its back end of line(BEOL)-compatible potential for the next generation dynamic random access memory(DRAM) application. In this work, thermal atomic layer deposition(TALD) indium gallium zinc oxide(IGZO) technology was explored. It was found that the atomic composition and the physical properties of the IGZO films can be modulated by changing the sub-cycles number during atomic layer deposition(ALD) process. In addition, thin-film transistors(TFTs) with vertical channel-all-around(CAA) structure were realized to explore the influence of different IGZO films as channel layers on the performance of transistors. Our research demonstrates that TALD is crucial for high density integration technology, and the proposed vertical IGZO CAA-TFT provides a feasible path to break through the technical problems for the continuous scale of electronic equipment. 展开更多
关键词 In-Ga-Zn-O(IGZO) thermal atomic layer deposition vertical channel thin-film transistor
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