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浆骨比对混凝土梁声发射信号的影响
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作者 虞爱平 李翔昊 +3 位作者 刘祥泰 丁俊业 钟展明 陈宣东 《混凝土》 CAS 北大核心 2024年第2期39-44,共6页
为研究弹性波在不同浆骨比混凝土内部传播的衰减特性,设计了3组不同浆骨比混凝土梁,提取模拟断铅声发射信号,进行声发射信号特征参数分析及频谱分析。结果表明:3组试件的幅值、能量、信号强度均会随传播距离的增加而呈现指数函数衰减,... 为研究弹性波在不同浆骨比混凝土内部传播的衰减特性,设计了3组不同浆骨比混凝土梁,提取模拟断铅声发射信号,进行声发射信号特征参数分析及频谱分析。结果表明:3组试件的幅值、能量、信号强度均会随传播距离的增加而呈现指数函数衰减,且衰减系数b因浆骨比的提高均有所下降;能量参数对于浆骨比变化的敏感程度最大,信号强度和幅值依次降低;随着浆骨比的提高,在Sensor1#~Sensor3#的峰值频率衰减程度呈现出逐渐递减的趋势。 展开更多
关键词 混凝土 浆骨比 声发射 衰减规律
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碳化硅MOS器件栅氧化层的钝化方法 被引量:1
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作者 贾一凡 刘祥泰 +7 位作者 田梦悦 陆芹 王少青 关云鹤 过立新 李立珺 郭三栋 陈海峰 《西安邮电大学学报》 2020年第3期55-63,105,共10页
碳化硅是一种典型的第三代半导体材料,适合用于制备高温、高压、大功率和抗辐射的电力电子器件,其金属氧化物半导体(metal-oxide-semiconductor,MOS)结构器件目前存在着沟道迁移率较低、栅氧化层可靠性较差等问题。根据陷阱的分布位置对... 碳化硅是一种典型的第三代半导体材料,适合用于制备高温、高压、大功率和抗辐射的电力电子器件,其金属氧化物半导体(metal-oxide-semiconductor,MOS)结构器件目前存在着沟道迁移率较低、栅氧化层可靠性较差等问题。根据陷阱的分布位置对MOS结构中的陷阱进行了分类,分别研究了NO退火钝化、氮磷同步混合钝化以及碱土金属氧化物钝化对不同类型陷阱的作用效果,并通过材料表征分析,揭示了不同钝化工艺对陷阱特性的影响机理。结果发现,NO退火能够减少界面处和近界面的电子陷阱,但也会在近界面附近引入大量的慢态空穴陷阱。氮磷同步混合钝化工艺通过在SiO2薄膜中引入适当浓度的P元素,能够有效减少氧化层中的陷阱,从而降低了栅漏电流。碱土金属钡氧化物钝化处理,在界面处会形成过氧化钡过渡层,能够降低界面处的陷阱密度。 展开更多
关键词 碳化硅 栅氧化层 NO退火 氮磷同步混合 碱土金属氧化物
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Performance study of vertical MSM solar-blind photodetectorsbased onβ-Ga_(2)O_(3)thin film
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作者 Chen Haifeng Che Lujie +8 位作者 Lu Qin Wang Shaoqing liu xiangtai liu Zhanhang Guan Youyou Zhao Xu Cheng Hang Han Xiaocong Zhang Xuhui 《The Journal of China Universities of Posts and Telecommunications》 EI CSCD 2024年第2期17-27,共11页
In this work,β-Ga_(2)O_(3)thin films were grown on SiO_(2)substrate by atomic layer deposition(ALD)and annealed in N_(2)atmosphere to enhance the crystallization quality of the thin films,which were verified from X-r... In this work,β-Ga_(2)O_(3)thin films were grown on SiO_(2)substrate by atomic layer deposition(ALD)and annealed in N_(2)atmosphere to enhance the crystallization quality of the thin films,which were verified from X-rays diffraction(XRD).Based on the grownβ-Ga_(2)O_(3)thin films,vertical metal-semiconductor-metal(MSM)interdigital photodetectors(PDs)were fabricated and investigated.The PDs have an ultralow dark current of 1.92 pA,ultra-high photo-to-dark current ratio(PDCR)of 1.7×10^(6),and ultra-high detectivity of 4.25×10^(14)Jones at a bias voltage of 10 V under 254 nm deep ultraviolet(DUV).Compared with the horizontal MSM PDs under the same process,the PDCR and detectivity of the fabricated vertical PDs are increased by 1000 times and 100 times,respectively.In addition,the vertical PDs possess a high responsivity of 34.24 A/W and an external quantum efficiency of 1.67×10^(4)%,and also exhibit robustness and repeatability,which indicate excellent performance.Then the effects of electrode size and external irradiation conditions on the performance of the vertical PDs continued to be investigated. 展开更多
关键词 Ga_(2)O_(3) atomic layer deposition(ALD) ANNEALING vertical metal-semiconductor-metal(MSM)interdigital photodetectors
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Preparation and characteristic study of Schottky diodes based on Ga_(2)O_(3)thin films
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作者 Zhang Xuhui Chen Haifeng +6 位作者 liu xiangtai Lu Qin Wang Zhan Cheng Hang Che Lujie Guan Youyou Han Xiaocong 《The Journal of China Universities of Posts and Telecommunications》 EI CSCD 2024年第2期28-37,共10页
This study uses atomic layer deposition(ALD)to grow Ga_(2)O_(3)films on SiO_(2)substrates and investigates the influence of film thickness and annealing temperature on film quality.Schottky diode devices are fabricate... This study uses atomic layer deposition(ALD)to grow Ga_(2)O_(3)films on SiO_(2)substrates and investigates the influence of film thickness and annealing temperature on film quality.Schottky diode devices are fabricated based on the grown Ga_(2)O_(3)films,and the effects of annealing temperature,electrode size,and electrode spacing on the electrical characteristics of the devices are studied.The results show that as the film thickness increases,the breakdown voltage of the fabricated devices also increases.A Schottky diode with a thickness of 240 nm can achieve a reverse breakdown voltage of 300 V.The film quality significantly improves as the annealing temperature of the film increases.At a voltage of 5 V,the current of the film annealed at 900℃is 64 times that of the film annealed at 700℃.The optimum annealing temperature for Ohmic contact electrodes is 450℃.At 550℃,the Ohmic contact metal tends to burn,and the performance of the device is reduced.Reducing the electrode spacing increases the forward current of the device but decreases the reverse breakdown voltage.Increasing the Schottky contact electrode size increases the forward current,but the change is not significant,and there is no significant change in the reverse breakdown voltage.The device also performs well at high temperatures,with a reverse breakdown voltage of 220 V at 125℃. 展开更多
关键词 atomic layer deposition(ALD) Ga_(2)O_(3)film Schottky diode annealing temperature
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