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Dual solidification mechanisms of liquid ternary Fe-Cu-Sn alloy
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作者 Weili Wang XiaoMei Zhang +1 位作者 liuhui li BingBo Wei 《Science China(Physics,Mechanics & Astronomy)》 SCIE EI CAS 2012年第3期450-459,共10页
Liquid ternary Fe47.5Cu47.5Sn5 alloy displayed dual solidification mechanisms when it was undercooled by up to 329 K (0.19TL). Below a critical undercooling of about 196 K, it solidified just like a normal peritecti... Liquid ternary Fe47.5Cu47.5Sn5 alloy displayed dual solidification mechanisms when it was undercooled by up to 329 K (0.19TL). Below a critical undercooling of about 196 K, it solidified just like a normal peritectic alloy, even though metastable phase separation occurred to a microscopic extent. Once bulk undercooling exceeds 196 K, macroscopic segregation played a domi- nant role in solidification. In both cases, the solidification process was always characterized by two successive peritectic trans- formations: firstly primary yFe dendrites reacted with liquid phase to form (Cu) phase, and subsequently the (Cu) phase reacted with residual liquid phase to yield β-Cu5.6Sn intermetallic compound. The primary yFe dendrites achieved a maximum growth velocity of 400 mm/s and experienced a growth kinetics transition as a result of macrosegregation. Since the (Cu) phase was both the product phase of the first peritectic transformation and also the reactant phase for the second peritectic transformation, it appeared as two layers in solidification microstructures due to the microsegregation of Sn solute. The boundary continuity between the macroscopically separated Fe-rich and Cu-ricb zones was enhanced with the increase of undercooling. 展开更多
关键词 peritectic solidification phase separation MACROSEGREGATION UNDERCOOLING dendritic growth
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