The joining of metal and polymer is an increasingly important method to get lightweight components in the development of manufacturing industry- nowadays. In this artiele, metal and polymer lap joint was achieved by m...The joining of metal and polymer is an increasingly important method to get lightweight components in the development of manufacturing industry- nowadays. In this artiele, metal and polymer lap joint was achieved by means of resistance spot welding （RSW） and ultrasonic assistance welding （UAW）. The joining mechanism of lap joint was analyzed by OM, TEM on microstructure at the interface of lap joints and XPS and IR spectra was discussed based on the following different ones： mechanical-interlocking, diffusion bond and coordination bond. The results showed that it was the combined action that played an important role in the effective joining work. Besides, ultrasonic assistance was used in the study to aid welding process based on its high-frequency ultrasonic vibration, which made joints shaping better and improved tensile strength visibly contrast to joints with the same lower heat input parameters.展开更多
在纳米工艺下,老化效应与软差错共同引发的集成电路可靠性问题至关重要,目前,考虑多个因素分析老化效应对软差错率影响的工作相对较少.作为一种典型的老化效应,偏置温度不稳定性(bias temperature instability,BTI)效应包括发生在PMOS...在纳米工艺下,老化效应与软差错共同引发的集成电路可靠性问题至关重要,目前,考虑多个因素分析老化效应对软差错率影响的工作相对较少.作为一种典型的老化效应,偏置温度不稳定性(bias temperature instability,BTI)效应包括发生在PMOS中的负偏置温度不稳定性(negative bias temperature instability,NBTI)和发生在NMOS中的正偏置温度不稳定性(positive bias temperature instability,PBTI),现有工作多聚焦在单个因素在NBTI下的影响.在BTI作用下门延迟对软差错率(soft error rate,SER)的影响研究工作的基础上,进一步研究了单粒子瞬态(single event transient,SET)故障脉冲宽度和关键电荷对SER的影响.首先通过考虑PBTI,完善了在BTI作用下基于32nm工艺SET脉宽的变化模型;然后分别研究了如何在SER的计算中考虑SET脉宽和关键电荷的影响,提出了SET脉宽变化可以反映在模拟注入电荷量的变化上的结论.通过HSPICE仿真验证和C++实验表明:3个因素中延迟和SET脉宽对SER影响较小,受BTI应力影响SER将增大,应力作用初期影响最为明显,之后影响将变缓.展开更多
文摘The joining of metal and polymer is an increasingly important method to get lightweight components in the development of manufacturing industry- nowadays. In this artiele, metal and polymer lap joint was achieved by means of resistance spot welding （RSW） and ultrasonic assistance welding （UAW）. The joining mechanism of lap joint was analyzed by OM, TEM on microstructure at the interface of lap joints and XPS and IR spectra was discussed based on the following different ones： mechanical-interlocking, diffusion bond and coordination bond. The results showed that it was the combined action that played an important role in the effective joining work. Besides, ultrasonic assistance was used in the study to aid welding process based on its high-frequency ultrasonic vibration, which made joints shaping better and improved tensile strength visibly contrast to joints with the same lower heat input parameters.
文摘在纳米工艺下,老化效应与软差错共同引发的集成电路可靠性问题至关重要,目前,考虑多个因素分析老化效应对软差错率影响的工作相对较少.作为一种典型的老化效应,偏置温度不稳定性(bias temperature instability,BTI)效应包括发生在PMOS中的负偏置温度不稳定性(negative bias temperature instability,NBTI)和发生在NMOS中的正偏置温度不稳定性(positive bias temperature instability,PBTI),现有工作多聚焦在单个因素在NBTI下的影响.在BTI作用下门延迟对软差错率(soft error rate,SER)的影响研究工作的基础上,进一步研究了单粒子瞬态(single event transient,SET)故障脉冲宽度和关键电荷对SER的影响.首先通过考虑PBTI,完善了在BTI作用下基于32nm工艺SET脉宽的变化模型;然后分别研究了如何在SER的计算中考虑SET脉宽和关键电荷的影响,提出了SET脉宽变化可以反映在模拟注入电荷量的变化上的结论.通过HSPICE仿真验证和C++实验表明:3个因素中延迟和SET脉宽对SER影响较小,受BTI应力影响SER将增大,应力作用初期影响最为明显,之后影响将变缓.
