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Mechanical Properties of Micro- and Nanostructured Copper Films
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作者 N. Kosarev m. khazin +1 位作者 R. Apakashev N. Valiev 《Journal of Materials Science and Chemical Engineering》 2013年第5期7-10,共4页
Mechanical properties of electrodeposited and electroless copper with nano- and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account t... Mechanical properties of electrodeposited and electroless copper with nano- and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation. 展开更多
关键词 Nano- and MICROCRYSTALLINE Materials HALL-PETCH Relation Yield Point Stress GRAIN Boundary HARDENING Coefficient NONEQUILIBRIUM GRAIN Boundaries
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