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Synthesis and identification of dinitro- and diaminoterephthalic acid 被引量:2
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作者 m.ghaemy H.Mighani 《Chinese Chemical Letters》 SCIE CAS CSCD 2009年第7期800-804,共5页
Dinitroterephthalic acid (DNTPA) and diaminoterephthalic acid (DATPA) were prepared in 85% and 75% yields, respectively. These compounds were characterized by using FTIR and ^1HNMR. DATPA can be used as a monomer ... Dinitroterephthalic acid (DNTPA) and diaminoterephthalic acid (DATPA) were prepared in 85% and 75% yields, respectively. These compounds were characterized by using FTIR and ^1HNMR. DATPA can be used as a monomer for the preparation of polyesters and polyamides. 2009 H. Migbani. Published by Elsevier B.V. on behalf of Chinese Chemical Society. All rights reserved. 展开更多
关键词 Terephthalic acid Dinitroterephthalic acid Diaminoterephthalic acid
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EFFECT OF NANOSILICA ON THE KINETICS OF CURE REACTION AND THERMAL DEGRADATION OF EPOXY RESIN 被引量:2
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作者 m.ghaemy M.Bazzar H.Mighani 《Chinese Journal of Polymer Science》 SCIE CAS CSCD 2011年第2期141-148,共8页
Nanocomposites from nanoscale silica particles(NS),diglycidylether of bisphenol-A based epoxy(DGEBA),and 3,5-diamino-N-(4-(quinolin-8-yloxy) phenyl) benzamide(DQPB) as curing agent were obtained from direct ... Nanocomposites from nanoscale silica particles(NS),diglycidylether of bisphenol-A based epoxy(DGEBA),and 3,5-diamino-N-(4-(quinolin-8-yloxy) phenyl) benzamide(DQPB) as curing agent were obtained from direct blending of these materials.The effect of nanosilica(NS) particles as catalyst on the cure reaction of DGEBA/DQPB system was studied by using non-isothermal DSC technique.The activation energy(E_a) was obtained by using Kissinger and Ozawa equations. The E_a value of curing of DGEBA/DQPB/10%NS system showed a decrease of about 10 kJ/mol indicating the catalytic effect of NS particles on the cure reaction.The E_a values of thermal degradation of the cured samples of both systems were 148 kJ/mol and 160 kJ/mol,respectively.The addition of 10%of NS to the curing mixture did not have much effect on the initial decomposition temperature(T_i) but increased the char residues from 20%to 28%at 650℃. 展开更多
关键词 THERMOSETS RESINS Curing of polymers Thermal properties DSC
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