Both direct current dc plasma and radio frequency induction plasma were used to deposit tungsten coatings on copper electrodes. Fine tungsten powder with mean particle size of 5 μm and coarse tungsten powder with par...Both direct current dc plasma and radio frequency induction plasma were used to deposit tungsten coatings on copper electrodes. Fine tungsten powder with mean particle size of 5 μm and coarse tungsten powder with particle size in the range from 45 μm to 75 μm were used as plasma spray feedstock. It is found that dc plasma is only applicable to spray the fine tungsten powder and induction plasma can be used to spray both the coarse powder and the fine powder. The tungsten coating deposited by the induction plasma spraying of the coarse powder is extremely dense. Such a coating with an interlocking structure and an integral interface with the copper substrate demonstrates high cohesion strength and adhesion strength.展开更多
Particle melting and substrate temperature are important in controlling deposited density and residual stress in thermal plasma deposition of refractory materials. In this paper, both the heating and cooling behaviour...Particle melting and substrate temperature are important in controlling deposited density and residual stress in thermal plasma deposition of refractory materials. In this paper, both the heating and cooling behaviours of tungsten particles inside a radio frequency inductively coupled plasma （ICP） and the plasma heat flux to the substrate were investigated. The distribution of the plasma-generated heat on device, powder injection probe, deposition chamber, and substrate was determined by measuring the water flow rate and the flow-in and flow-out water temperatures in the four parts. Substrate temperature was measured by a two-colour pyrometer during the ICP deposition of tungsten. Experimental results show that the heat flux to the substrate accounts for about 20% of the total plasma energy, the substrate temperature can reach as high as 2100 K, and the heat loss by radiation is significant in the plasma deposition of tungsten.展开更多
文摘Both direct current dc plasma and radio frequency induction plasma were used to deposit tungsten coatings on copper electrodes. Fine tungsten powder with mean particle size of 5 μm and coarse tungsten powder with particle size in the range from 45 μm to 75 μm were used as plasma spray feedstock. It is found that dc plasma is only applicable to spray the fine tungsten powder and induction plasma can be used to spray both the coarse powder and the fine powder. The tungsten coating deposited by the induction plasma spraying of the coarse powder is extremely dense. Such a coating with an interlocking structure and an integral interface with the copper substrate demonstrates high cohesion strength and adhesion strength.
文摘Particle melting and substrate temperature are important in controlling deposited density and residual stress in thermal plasma deposition of refractory materials. In this paper, both the heating and cooling behaviours of tungsten particles inside a radio frequency inductively coupled plasma （ICP） and the plasma heat flux to the substrate were investigated. The distribution of the plasma-generated heat on device, powder injection probe, deposition chamber, and substrate was determined by measuring the water flow rate and the flow-in and flow-out water temperatures in the four parts. Substrate temperature was measured by a two-colour pyrometer during the ICP deposition of tungsten. Experimental results show that the heat flux to the substrate accounts for about 20% of the total plasma energy, the substrate temperature can reach as high as 2100 K, and the heat loss by radiation is significant in the plasma deposition of tungsten.
