Tailoring Polyimide Chain by Melamine-Cyanurate Supramolecule via a Molecular Welding Strategy Achieving Superior Thermal Conductivity

Polyimide(PI)films are widely used in printed circuit boards,electronic packaging,interlayer media,display panels,and other fields.Improving the thermal conductivity of PI film is of great significance to promote effective heat removal in microelectronic devices.Herein,melamine cyanurate(MC)with multiple hydrogen bonds was designed and introduced into water-soluble polyamide acid(Ws-PAA)solution via an in-situ co-precipitation method.The MC supramolecule forms a chemical bond at the end of the PI chain,while also confines the adjacent chains through hydrogen bonds andπ-πconjugation,functioning as a tailor to improve the chain arrangement via this molecular welding strategy.The tailored PI/MC films exhibit anisotropic thermal conductivity(TC):the in-plane TC can reach 0.93 W/(mK)while the through-plane TC is 0.60 W/(mK).Micromorphology and structural characterizations confirm the formation of complete heat conduction pathways.The developed films also show potential application prospects functioning as heat dissipation media in microelectronic devices.

侧氰基芳醚硅芳炔树脂的制备与表征

在无水三氟甲磺酸锌催化下通过2,6-双-(4-乙炔基苯氧基)-苯腈和二甲基二氯硅烷室温反应制备了侧氰基芳醚硅芳炔树脂(CNSA);采用1H-NMR、FTIR、DSC、TGA等分析测试技术表征了CNSA的结构与性能。结果显示,CNSA树脂具有好的溶解性和宽的加工窗口,可在较低温度(<200℃)下发生固化反应;树脂固化物具有好的热性能,在50~400℃之间无玻璃化转变,在N2中质量损失5%的温度Td5达512℃;T300碳纤维平纹布/CNSA(CF/CNSA)复合材料的室温弯曲强度达383.8 MPa,弯曲模量为62.9 GPa。