For time-of-flight(TOF)light detection and ranging(LiDAR),a three-channel high-performance transimpedance amplifier(TIA)with high immunity to input load capacitance is presented.A regulated cascade(RGC)as the input st...For time-of-flight(TOF)light detection and ranging(LiDAR),a three-channel high-performance transimpedance amplifier(TIA)with high immunity to input load capacitance is presented.A regulated cascade(RGC)as the input stage is at the core of the complementary metal oxide semiconductor(CMOS)circuit chip,giving it more immunity to input photodiode detectors.A simple smart output interface acting as a feedback structure,which is rarely found in other designs,reduces the chip size and power consumption simultaneously.The circuit is designed using a 0.5μm CMOS process technology to achieve low cost.The device delivers a 33.87 dB?transimpedance gain at 350 MHz.With a higher input load capacitance,it shows a-3 dB bandwidth of 461 MHz,indicating a better detector tolerance at the front end of the system.Under a 3.3 V supply voltage,the device consumes 5.2 mW,and the total chip area with three channels is 402.8×597.0μm2(including the test pads).展开更多
文摘For time-of-flight(TOF)light detection and ranging(LiDAR),a three-channel high-performance transimpedance amplifier(TIA)with high immunity to input load capacitance is presented.A regulated cascade(RGC)as the input stage is at the core of the complementary metal oxide semiconductor(CMOS)circuit chip,giving it more immunity to input photodiode detectors.A simple smart output interface acting as a feedback structure,which is rarely found in other designs,reduces the chip size and power consumption simultaneously.The circuit is designed using a 0.5μm CMOS process technology to achieve low cost.The device delivers a 33.87 dB?transimpedance gain at 350 MHz.With a higher input load capacitance,it shows a-3 dB bandwidth of 461 MHz,indicating a better detector tolerance at the front end of the system.Under a 3.3 V supply voltage,the device consumes 5.2 mW,and the total chip area with three channels is 402.8×597.0μm2(including the test pads).
