Comparison between vitrified bond and resin bond diamond grinding wheel in grinding PDC

In this research,the advantages and disadvantages of the cylindrical grinding process of Polycrystalline Diamond Compacts(short for PDC) with vitrified and resin bond diamond grinding wheel are compared.The research results show that the vitrified bond diamond grinding wheels,which use Ti-coated diamond grains as abrasive and glass ceramic as bond,have many advantages in grinding PDC.Compared with resin diamond grinding wheel,vitrified bond wheels lead to 35% grinding cost reduced,40% grinding time of each PDC saved,and the size precision of PDC improved(from ±0.03mm to ±0.01mm).When grinding feed is <0.10 mm,the grinding ratio increases with increased grinding feed.However,when the grinding feed exceeds 0.10 mm,the grinding radio decreases rapidly with the increasing of grinding feed.The disadvantage of this kind of grinding wheel is that the brightness of the ground PDC cylinder is not as shining as that processed by resin bond diamond grinding wheel.

微纳米加工技术

无论是集成电路技术，还是微系统技术或纳米技术，其共同特征是功能结构的尺寸在微米或纳米范围，因此可以统称为微纳米技术。功能结构的微纳米化带来的不仅仅是能源与原材料的节省，而且导致多功能的高度集成和生产成本的大大降低。微纳米技术依赖于微纳米尺度的功能结构与器件。实现功能结构微纳米化的基础是先进的微纳米加工技术。本书作者力求全面介绍微纳米加工方面的各种技术，并且介绍了微纳米加工技术的最新进展。