The characterization of pyroelectric materials is essential for the design of pyroelectric-based devices.Pyroelectric current measurement is the commonly employed method,but can be complex and requires surface electro...The characterization of pyroelectric materials is essential for the design of pyroelectric-based devices.Pyroelectric current measurement is the commonly employed method,but can be complex and requires surface electrodes.Here,we present noncontact electrostatic voltmeter measurements as a simple but highly accurate alternative,by assessing thermally-induced pyroelectric surface potential variations.We introduce a refined model that relates the surface potential variations to both the pyroelectric coefficient and the characteristic figure of merit(FOM)and test the model with square-shaped samples made from PVDF,LiNbO3 and LiTaO3.The characteristic pyroelectric coefficient for PVDF,LiNbO3 and LiTaO3 was found to be 33.4,59.9 and 208.4μC m−2 K−1,respectively.These values are in perfect agreement with literature values,and they differ by less than 2.5%from values that we have obtained with standard pyroelectric current measurements for comparison.展开更多
Metal oxide thin films for soft and flexible electronics require low cost,room temperature fabrication,and structuring processes.We here introduce an anodic printing process to realize the essential building blocks of...Metal oxide thin films for soft and flexible electronics require low cost,room temperature fabrication,and structuring processes.We here introduce an anodic printing process to realize the essential building blocks of electronic circuitry,including resistors,capacitors,field-effect transistors,diodes,rectifiers,and memristors directly on imperceptible plastic substrates.Largely independent on surface properties,we achieve high-quality,few nanometer thin dielectric and semiconducting films even on rough substrates via localized anodisation of valve metals using a scanning droplet cell microscope.We demonstrate printing-like fabrication of 3D multilayer solid-state capacitors with a record-high areal capacity of 4μF cm−2.Applicable to the whole class of valve metals and their alloys,our method provides a versatile fabrication technique for the circuits that empower the flexible and stretchable electronics of tomorrow.展开更多
基金supported by the European Horizon 2020 grant“SensApp”under Grant Agreement No.829104.
文摘The characterization of pyroelectric materials is essential for the design of pyroelectric-based devices.Pyroelectric current measurement is the commonly employed method,but can be complex and requires surface electrodes.Here,we present noncontact electrostatic voltmeter measurements as a simple but highly accurate alternative,by assessing thermally-induced pyroelectric surface potential variations.We introduce a refined model that relates the surface potential variations to both the pyroelectric coefficient and the characteristic figure of merit(FOM)and test the model with square-shaped samples made from PVDF,LiNbO3 and LiTaO3.The characteristic pyroelectric coefficient for PVDF,LiNbO3 and LiTaO3 was found to be 33.4,59.9 and 208.4μC m−2 K−1,respectively.These values are in perfect agreement with literature values,and they differ by less than 2.5%from values that we have obtained with standard pyroelectric current measurements for comparison.
基金Work supported by the ERC Advanced Investigators Grant‘Soft-Map’under grant agreement no.291429the ERC Starting Grant‘GEL-SYS’under grant agreement no.757931+3 种基金startup funding of the Linz Institute of Technology under grant no.LIT013144001SELthe JST Someya Bio-Harmonized ERATO grantFinancial support by the Austrian Federal Ministry of Science,Research and Economy and the National Foundation for Research,Technology and Development through funding of the Christian Doppler Laboratory for Combinatorial Oxide Chemistry(COMBOX)is gratefully acknowledgedAdditional funding was provided by an IEEE/DEIS Graduate Student Award of C.M.Siket,a Macke mobility scholarship,the regional government(Land OO),and the‘Forschungsförderung’of JKU.
文摘Metal oxide thin films for soft and flexible electronics require low cost,room temperature fabrication,and structuring processes.We here introduce an anodic printing process to realize the essential building blocks of electronic circuitry,including resistors,capacitors,field-effect transistors,diodes,rectifiers,and memristors directly on imperceptible plastic substrates.Largely independent on surface properties,we achieve high-quality,few nanometer thin dielectric and semiconducting films even on rough substrates via localized anodisation of valve metals using a scanning droplet cell microscope.We demonstrate printing-like fabrication of 3D multilayer solid-state capacitors with a record-high areal capacity of 4μF cm−2.Applicable to the whole class of valve metals and their alloys,our method provides a versatile fabrication technique for the circuits that empower the flexible and stretchable electronics of tomorrow.
