Scalable fabrication of high-rate micro-supercapacitors(MSCs)is highly desired for on-chip integration of energy storage components.By virtue of the special self-assembly behavior of 2D materials during drying thin fi...Scalable fabrication of high-rate micro-supercapacitors(MSCs)is highly desired for on-chip integration of energy storage components.By virtue of the special self-assembly behavior of 2D materials during drying thin films of their liquid dispersion,a new inkjet printing technique of passivated graphene micro-flakes is developed to directly print MSCs with 3D networked porous microstructure.The presence of macroscale through-thickness pores provides fast ion transport pathways and improves the rate capability of the devices even with solid-state electrolytes.During multiple-pass printing,the porous microstructure effectively absorbs the successively printed inks,allowing full printing of 3D structured MSCs comprising multiple vertically stacked cycles of current collectors,electrodes,and sold-state electrolytes.The all-solid-state heterogeneous 3D MSCs exhibit excellent vertical scalability and high areal energy density and power density,evidently outperforming the MSCs fabricated through general printing techniques.展开更多
Copper is an interesting material for printed electronics inks because, for example, of its good conductivity and lower raw material price compared to silver. However, post-processing Cu inks is challenging because of...Copper is an interesting material for printed electronics inks because, for example, of its good conductivity and lower raw material price compared to silver. However, post-processing Cu inks is challenging because of non-conductive copper oxide. In this work, inkjet-printed Cu nanoparticle structures were sintered on a polyimide substrate with a continuous-wave 808-nm diode laser. Laser sintering was tested by varying the sintering parameters (optical power and scanning velocity), and the electrical resistance of the samples was measured. A minimum sheet resistance of approx.90 mΩ/□ was obtained. All tests were run in room conditions. Sintered structures were then analyzed from SEM images. Results showed that laser sintering produces good repeatability, that a scanning velocity increment positively affects the process window, and that multiple sintering cycles do not increase conductivity.展开更多
基金financial support of the Swedish Research Council through the Marie Sklodowska-Curie International Career Grant (No.2015-00395,co-funded by Marie Sklodowska-Curie Actions, through the Project INCA 600398)the Formas Foundation through the Future Research Leaders Grant (No.2016-00496)+3 种基金the AForsk Foundation (Grant No.17-352)the Olle Engkvist Byggmastare Foundation (Grant No.2014/799)the Academy of Finland (Grant No.288945 and 319408)Academy of Finland Research Infrastructure "Printed Intelligence Infrastructure" (PII-FIRI,Grant No. 320019)
文摘Scalable fabrication of high-rate micro-supercapacitors(MSCs)is highly desired for on-chip integration of energy storage components.By virtue of the special self-assembly behavior of 2D materials during drying thin films of their liquid dispersion,a new inkjet printing technique of passivated graphene micro-flakes is developed to directly print MSCs with 3D networked porous microstructure.The presence of macroscale through-thickness pores provides fast ion transport pathways and improves the rate capability of the devices even with solid-state electrolytes.During multiple-pass printing,the porous microstructure effectively absorbs the successively printed inks,allowing full printing of 3D structured MSCs comprising multiple vertically stacked cycles of current collectors,electrodes,and sold-state electrolytes.The all-solid-state heterogeneous 3D MSCs exhibit excellent vertical scalability and high areal energy density and power density,evidently outperforming the MSCs fabricated through general printing techniques.
基金M.Mäntysalo is sponsored by Academy of Finland with grant No.251882.
文摘Copper is an interesting material for printed electronics inks because, for example, of its good conductivity and lower raw material price compared to silver. However, post-processing Cu inks is challenging because of non-conductive copper oxide. In this work, inkjet-printed Cu nanoparticle structures were sintered on a polyimide substrate with a continuous-wave 808-nm diode laser. Laser sintering was tested by varying the sintering parameters (optical power and scanning velocity), and the electrical resistance of the samples was measured. A minimum sheet resistance of approx.90 mΩ/□ was obtained. All tests were run in room conditions. Sintered structures were then analyzed from SEM images. Results showed that laser sintering produces good repeatability, that a scanning velocity increment positively affects the process window, and that multiple sintering cycles do not increase conductivity.
