Gold, nickel and copper are usually used in connector of the smart card. Since Au is expensive and Ni is an allergenic material, simulated (CES) and bibliographical work is carried out in order to replace the Au and N...Gold, nickel and copper are usually used in connector of the smart card. Since Au is expensive and Ni is an allergenic material, simulated (CES) and bibliographical work is carried out in order to replace the Au and Ni layer in smart card connectors without sacrificing reliability. During the work, mechanical and electrical properties, corrosion resistance, cost, toxicity and process compatibility of the samples have been taken into consideration. Cu alloying with Zn or Sn, Cr and stainless steel were selected for electrodeposition process. Secondly, carbides (WC, TiC, ZrC), Ti, TiN, borides (TiB2) and silicide (MoSi2) are considered as a vapour deposited materials and some Cu alloying with Al, N or Mg also considered via ion implantation processes. But, vapour deposition and implantation are high energy processes compared to the electrodeposition process, which is expensive. Therefore, electrodeposited materials such as, Cu alloys (Brass or bronze), Cr and stainless steel could be considered as promising candidate to replace the Au and Ni layer in smart card connectors.展开更多
文摘Gold, nickel and copper are usually used in connector of the smart card. Since Au is expensive and Ni is an allergenic material, simulated (CES) and bibliographical work is carried out in order to replace the Au and Ni layer in smart card connectors without sacrificing reliability. During the work, mechanical and electrical properties, corrosion resistance, cost, toxicity and process compatibility of the samples have been taken into consideration. Cu alloying with Zn or Sn, Cr and stainless steel were selected for electrodeposition process. Secondly, carbides (WC, TiC, ZrC), Ti, TiN, borides (TiB2) and silicide (MoSi2) are considered as a vapour deposited materials and some Cu alloying with Al, N or Mg also considered via ion implantation processes. But, vapour deposition and implantation are high energy processes compared to the electrodeposition process, which is expensive. Therefore, electrodeposited materials such as, Cu alloys (Brass or bronze), Cr and stainless steel could be considered as promising candidate to replace the Au and Ni layer in smart card connectors.
