Enhanced composite thermal conductivity by percolated networks of in-situ confined-grown carbon nanotubes

Despite the ever-increasing demand of nanofillers for thermal enhancement of polymer composites with higher thermal conductivity and irregular geometry,nanomaterials like carbon nanotubes(CNTs)have been constrained by the nonuniform dispersion and difficulty in constructing effective three-dimensional(3D)conduction network with low loading and desired isotropic or anisotropic(specific preferred heat conduction)performances.Herein,we illustrated the in-situ construction of CNT based 3D heat conduction networks with different directional performances.First,to in-situ construct an isotropic percolated conduction network,with spherical cores as support materials,we developed a confined-growth technique for CNT-core sea urchin(CNTSU)materials.With 21.0 wt.%CNTSU loading,the thermal conductivity of composites reached 1.43±0.13 W/(m·K).Secondly,with aligned hexagonal boron nitride(hBN)as an anisotropic support,we constructed CNT-hBN aligned networks by in-situ CNT growth,which improved the utilization efficiency of high density hBN and reduced the thermal interface resistance between matrix and fillers.With~8.5 wt.%loading,the composites possess thermal conductivity up to 0.86±0.14 W/(m·K),374%of that for neat matrix.Due to the uniformity of CNTs in hBN network,the synergistic thermal enhancement from one-dimensional(1D)+two-dimensional(2D)hybrid materials becomes more distinct.Based on the detailed experimental evidence,the importance of purposeful production of a uniformly interconnected heat conduction 3D network with desired directional performance can be observed,particularly compared with the traditional direct-mixing method.This study opens new possibilities for the preparation of high-power-density electronics packaging and interfacial materials when both directional thermal performance and complex composite geometry are simultaneously required.

SU8 etch mask for patterning PDMS and its application to flexible fluidic microactuators

Over the past few decades,polydimethylsiloxane(PDMS)has become the material of choice for a variety of microsystem applications,including microfluidics,imprint lithography,and soft microrobotics.For most of these applications,PDMS is processed by replication molding;however,new applications would greatly benefit from the ability to pattern PDMS films using lithography and etching.Metal hardmasks,in conjunction with reactive ion etching(RIE),have been reported as a method for patterning PDMS;however,this approach suffers from a high surface roughness because of metal redeposition and limited etch thickness due to poor etch selectivity.We found that a combination of LOR and SU8 photoresists enables the patterning of thick PDMS layers by RIE without redeposition problems.We demonstrate the ability to etch 1.5-μm pillars in PDMS with a selectivity of 3.4.Furthermore,we use this process to lithographically process flexible fluidic microactuators without any manual transfer or cutting step.The actuator achieves a bidirectional rotation of 50°at a pressure of 200 kPa.This process provides a unique opportunity to scale down these actuators as well as other PDMS-based devices.