A novel method to improve interfacial bonding of compound squeeze cast Al/Al-Cu macrocomposite bimetals:Simulation and experimental studies

A facile and innovative method to improve bonding between the two parts of compound squeeze cast Al/Al-4.5 wt.%Cu macrocomposite bimetals was developed and its effects on microstructure and mechanical properties of the bimetal were investigated.A special concentric groove pattern was machined on the top surface of the insert(squeeze cast Al-4.5 wt.%Cu) and its effects on heat transfer,solidification and distribution of generated stresses along the interface region of the bimetal components were simulated using ProCAST and ANSYS softwares and experimentally verified. Simulation results indicated complete melting of the tips of the surface grooves and local generation of large stress gradient fields along the interface. These are believed to result in rupture of the insert interfacial aluminum oxide layer facilitating diffusion bonding of the bimetal components. Microstructural evaluations confirmed formation of an evident transition zone along the interface region of the bimetal. Average thickness of the transition zone and tensile strength of the bimetal were significantly increased to about 375 μm and 54 MPa, respectively, by applying the surface pattern.The proposed method is an affordable and promising approach for compound squeeze casting of Al-Al macrocomposite bimetals without resort to any prior cost and time intensive chemical or coating treatments of the solid insert.

Simulation and experimental verification of interfacial interactions in compound squeeze cast Al/Al-Cu macrocomposite bimetal

The objective of this work was to investigate the thermal and mechanical interactions between the two components of a compound squeeze cast macrocomposite bimetal. First, an Al/Al-4.5wt.%Cu macrocomposite bimetal was fabricated by compound squeeze casting process. Then, heat transfer, solidification and distribution of the generated stresses along the interface region of the bimetal were analyzed using Thermo-Calc, ProCAST and ANSYS softwares, and structure, copper distribution and microhardness changes across the interface of the bimetal were studied. The results showed no noticeable change in the structure of the Al-4.5wt.%Cu insert and no obvious micromixing and diffusion of copper across the interface. Simulation results were in good agreement with the experimental ones only when an equivalent oxide layer at the interface was defined and its effect on heat transfer was considered. This layer caused up to 50% decrease in local liquid fraction formed on the surface of the insert. Simulation of the generated stresses showed a uniformly distributed stress along the interface which was significantly lower than the compressive strength of the oxide layer, resulting in its good stability during the fabrication process. It was postulated that this continuous oxide layer not only acted as a thermal barrier but prevented the direct metal-metal contact along the interface as well.