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放电等离子体烧结技术制备过共晶Al-Si-Fe粉末冶金合金的显微组织和压缩变形行为(英文) 被引量:3
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作者 Jewoosoo kim Gwang-Seon JANG +1 位作者 mok-soon kim Jeong-Keun LEE 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2014年第7期2346-2351,共6页
Al-Si-Fe基铝合金材料由于具有高耐磨性、低密度以及低热膨胀性能,因而主要用于汽车发动机部件。利用气体雾化粉末,采用放电等离子体烧结技术制备Al-17Si-5Fe-2Cu-1Mg-1Ni-1Zr合金。所制备材料的晶粒尺寸为530 nm,并且观察到细等轴晶粒... Al-Si-Fe基铝合金材料由于具有高耐磨性、低密度以及低热膨胀性能,因而主要用于汽车发动机部件。利用气体雾化粉末,采用放电等离子体烧结技术制备Al-17Si-5Fe-2Cu-1Mg-1Ni-1Zr合金。所制备材料的晶粒尺寸为530 nm,并且观察到细等轴晶粒和均匀分布的析出物。研究了放电等离子体烧结技术制备的材料在不同温度和应变速率下的压缩变形行为。结果表明,所有的真应力-真应变曲线在达到峰值应力后呈稳态流动趋势,随着测试温度的升高和应变速率的降低,峰值应力呈下降趋势。在变形样品中,观察到了等轴晶粒和等轴晶粒中的位错结构。这些现象说明,合金在高温变形过程中发生了动态再结晶。 展开更多
关键词 AL-SI-FE合金 粉末冶金 放电等离子体技术 显微组织 变形
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Reliability of flip-chip bonded RFID die using anisotropic conductive paste hybrid material 被引量:1
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作者 Jun-Sik LEE Jun-Ki kim +2 位作者 mok-soon kim Namhyun KANG Jong-Hyun LEE 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2011年第A01期175-181,共7页
A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency ide... A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency identification(RFID) inlay. The optimization condition for flip-chip bonding was determined from the behavior of bonding strength. Under the optimized condition, the shear strength for the antenna printed with paste-type Ag ink was larger than that for Cu antenna. Furthermore, an identification distance was varied from the antenna materials. Comparing with the Ag antenna pattern, the as-bonded die on Cu antenna showed a larger distance of identification. However, the long-term reliability of inlay using the Cu antenna was decreased significantly as a function of aging time at room temperature because of the bended shape of Cu antenna formed during the flip-chip bonding process. 展开更多
关键词 可靠性调查 混合材料 倒装芯片 各向异性 RFID 导电膏 无线电频率识别 天线方向图
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Formation of unidirectional nanoporous structures in thickly anodized aluminum oxide layer 被引量:1
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作者 Hyun-Chae NA Taek-Jin SUNG +6 位作者 Seok-Heon YOON Seung-Kyoun HYUN mok-soon kim Young-Gi LEE Sang-Hyun SHIN Seok-Moon CHOI Sung YI 《中国有色金属学会会刊:英文版》 EI CSCD 2009年第4期1013-1017,共5页
A series of anodic aluminum oxide(AAO) was grown on the commercially pure 1050 aluminum sheet by controlling electrolyte temperature(2-15 ℃) and anodizing time(0.5-6 h),using a fixed applied current density of 3 A/dm... A series of anodic aluminum oxide(AAO) was grown on the commercially pure 1050 aluminum sheet by controlling electrolyte temperature(2-15 ℃) and anodizing time(0.5-6 h),using a fixed applied current density of 3 A/dm2 in diluted sulfuric acid electrolyte.A crack-free thick AAO with the thickness of 105-120 μm and containing unidirectional nano sized pores(average pore diameter of 5-7 nm) is successfully achieved in the specimens anodized for 2 h,irrespective of electrolyte temperature.When anodizing time reaches 6 h,very thick AAO with the thickness of 230-284 μm is grown,and average diameter of unidirectional pores is in the range of 6-24 nm.The higher values in both the AAO thickness and pore diameter are attained for the specimens anodized at higher temperatures of 10-15 ℃.A crack is observed to exist in the AAO after anodizing up to 4 h and more.A higher fraction(more than 9%) of the crack is shown in the specimens anodized at higher temperatures of 10-15 ℃ for 6 h and a considerable amount of giant cracks are contained. 展开更多
关键词 阳极氧化铝 纳米孔 单向 结构层 电解液温度 平均直径 氧化时间 硫酸电解液
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